自由才谨慎
发表于 2025-3-21 16:33:28
书目名称Microelectronics Manufacturing Diagnostics Handbook影响因子(影响力)<br> http://figure.impactfactor.cn/if/?ISSN=BK0633211<br><br> <br><br>书目名称Microelectronics Manufacturing Diagnostics Handbook影响因子(影响力)学科排名<br> http://figure.impactfactor.cn/ifr/?ISSN=BK0633211<br><br> <br><br>书目名称Microelectronics Manufacturing Diagnostics Handbook网络公开度<br> http://figure.impactfactor.cn/at/?ISSN=BK0633211<br><br> <br><br>书目名称Microelectronics Manufacturing Diagnostics Handbook网络公开度学科排名<br> http://figure.impactfactor.cn/atr/?ISSN=BK0633211<br><br> <br><br>书目名称Microelectronics Manufacturing Diagnostics Handbook被引频次<br> http://figure.impactfactor.cn/tc/?ISSN=BK0633211<br><br> <br><br>书目名称Microelectronics Manufacturing Diagnostics Handbook被引频次学科排名<br> http://figure.impactfactor.cn/tcr/?ISSN=BK0633211<br><br> <br><br>书目名称Microelectronics Manufacturing Diagnostics Handbook年度引用<br> http://figure.impactfactor.cn/ii/?ISSN=BK0633211<br><br> <br><br>书目名称Microelectronics Manufacturing Diagnostics Handbook年度引用学科排名<br> http://figure.impactfactor.cn/iir/?ISSN=BK0633211<br><br> <br><br>书目名称Microelectronics Manufacturing Diagnostics Handbook读者反馈<br> http://figure.impactfactor.cn/5y/?ISSN=BK0633211<br><br> <br><br>书目名称Microelectronics Manufacturing Diagnostics Handbook读者反馈学科排名<br> http://figure.impactfactor.cn/5yr/?ISSN=BK0633211<br><br> <br><br>
容易生皱纹
发表于 2025-3-21 23:07:25
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florid
发表于 2025-3-22 04:16:19
Manufacturing Yield,ircuit (IC) chips to optimize cost and technology. In turn, cost is dependent on manufacturing yield, which is the thrust of yield management at the initiation of a new technology, and the focus of this chapter.
Meditative
发表于 2025-3-22 04:40:56
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Watemelon
发表于 2025-3-22 08:47:11
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barium-study
发表于 2025-3-22 15:22:00
Artificial Intelligence Techniques for Analysis: Expert Systems and Neural Networks,ms, and so on” (Barr and Feigenbaum 1981). In this chapter, we focus on two areas of artificial intelligence that have shown great promise in microelectronic manufacturing diagnosis: expert systems and neural networks.
AUGUR
发表于 2025-3-22 20:29:01
Bum-in,SI semiconductor engineer. Covered in this chapter is a discussion of the important parameters affecting the burn-in, how to model the effects of burn-in and how to implement an effective burn-in process.
BARB
发表于 2025-3-22 22:13:40
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核心
发表于 2025-3-23 04:42:56
Manufacturing Defect Classification System,em will enable better communications between professionals in the field. Hundreds of different defect types exist, and many of the defects mentioned here are also discussed in other chapters of the hand-book.
pester
发表于 2025-3-23 09:36:29
In-Line Electrical Test,the line. Here, the cumulative effect of processes can be determined prior to final or functional test at the end of the process line. In-line test determines how the product is doing, while building takes place.