肥料
发表于 2025-3-28 16:43:58
Final Test,f assembly. This section will discuss some of the techniques used to achieve this process. This chapter will concentrate on the semiconductor level of test as opposed to card or system level test. The techniques in many cases apply to the higher levels of assembly testing as well.
MOT
发表于 2025-3-28 18:45:05
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自作多情
发表于 2025-3-29 01:19:10
Failure Analysis of Semiconductor Devices,nsistors (FET). Present integrated circuit complexity has increased, and device geometries have decreased to submicron dimensions. With this increase in manufacturing complexity, needs dictate state-of-the-art analytical capabilities to support product production and to continue to assure reliabilit
catagen
发表于 2025-3-29 04:34:35
Materials and Chemical Analysis of Electronic Devices,vices involves hundreds of operations, each individual manufacturing step must be controlled within very small tolerances to produce a large percentage of devices with good performance, i.e., there must be an economically meaningful product yield. The procedures defined in the other chapters of this
coagulation
发表于 2025-3-29 08:51:13
Modeling for Manufacturing Diagnostics,ndesirable) results to input parameters or conditions. This process is most efficient if a model of the system is used, together with well designed experiments. As it is used in many different contexts with different meanings, we define the term model to mean: an executable implementation of theoret
过滤
发表于 2025-3-29 13:02:41
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MERIT
发表于 2025-3-29 19:11:10
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疾驰
发表于 2025-3-29 20:24:11
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Dignant
发表于 2025-3-30 03:14:44
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cuticle
发表于 2025-3-30 05:54:28
https://doi.org/10.1007/978-1-4615-2029-0diagnosis; manufacturing; material; reliability; semiconductor devices