OBESE
发表于 2025-3-21 16:40:50
书目名称Electronics Production Defects and Analysis影响因子(影响力)<br> http://figure.impactfactor.cn/if/?ISSN=BK0306479<br><br> <br><br>书目名称Electronics Production Defects and Analysis影响因子(影响力)学科排名<br> http://figure.impactfactor.cn/ifr/?ISSN=BK0306479<br><br> <br><br>书目名称Electronics Production Defects and Analysis网络公开度<br> http://figure.impactfactor.cn/at/?ISSN=BK0306479<br><br> <br><br>书目名称Electronics Production Defects and Analysis网络公开度学科排名<br> http://figure.impactfactor.cn/atr/?ISSN=BK0306479<br><br> <br><br>书目名称Electronics Production Defects and Analysis被引频次<br> http://figure.impactfactor.cn/tc/?ISSN=BK0306479<br><br> <br><br>书目名称Electronics Production Defects and Analysis被引频次学科排名<br> http://figure.impactfactor.cn/tcr/?ISSN=BK0306479<br><br> <br><br>书目名称Electronics Production Defects and Analysis年度引用<br> http://figure.impactfactor.cn/ii/?ISSN=BK0306479<br><br> <br><br>书目名称Electronics Production Defects and Analysis年度引用学科排名<br> http://figure.impactfactor.cn/iir/?ISSN=BK0306479<br><br> <br><br>书目名称Electronics Production Defects and Analysis读者反馈<br> http://figure.impactfactor.cn/5y/?ISSN=BK0306479<br><br> <br><br>书目名称Electronics Production Defects and Analysis读者反馈学科排名<br> http://figure.impactfactor.cn/5yr/?ISSN=BK0306479<br><br> <br><br>
Axon895
发表于 2025-3-21 20:31:20
Electronics Production Defects and Analysis978-981-16-9824-8Series ISSN 2731-4200 Series E-ISSN 2731-4219
Cardiac
发表于 2025-3-22 02:16:18
Socio-Markers and Information Transmissionvolved activity which comprises a multitude of tasks. Utmost attention shall be paid to each and every element and the respective production stage, in the process. This involves establishing after suitable validation soldering of miniscule electronic components, control on soldering of the paddle of
比赛用背带
发表于 2025-3-22 06:22:39
http://reply.papertrans.cn/31/3065/306479/306479_4.png
复习
发表于 2025-3-22 09:40:02
Bjoern Oest Hansen,Jan Taubert,Thomas Thielrapment leading to conductive anodic filament formation. Also, the PTH barrel integrity can be affected if the process control measures are not strictly followed. Moreover, the solderability of the PCBs can be impaired due to the formation of thick intermetallic compound on improper storage of the f
监禁
发表于 2025-3-22 16:16:33
Hinderk M. Emrich,Michael Wiegandthe defects arising due to offset in mounting of ICs, non-standard mounting of capacitors, damaged end termination of SMT devices, lead deformation on mounting of ICs, inadequate electrical clearance and improper lead formation. The case of mounting defect due to inadequate heel in ICs has been capt
监禁
发表于 2025-3-22 18:02:04
https://doi.org/10.1007/978-1-4614-8630-5nd shock environments. The commonly used conformal coating material and their applications are tabulated. Proper cleaning of the surfaces, masking the required areas including irregular surfaces with tapes and baking shall be strictly adhered to proscribe any defects. Three typical defects encounter
性满足
发表于 2025-3-22 21:49:09
http://reply.papertrans.cn/31/3065/306479/306479_8.png
似少年
发表于 2025-3-23 02:45:27
http://reply.papertrans.cn/31/3065/306479/306479_9.png
我说不重要
发表于 2025-3-23 08:54:49
Valeria De Bedout,Anna J. Nicholss can happen probably because of non-availability of equivalent devices and substituting with near equivalent ones which need not be form and fit although may be functionally equivalent. This results in issues such as failure to maintain adequate clearance between conductive elements, single point f