hegemony
发表于 2025-3-26 22:54:53
Soldering Defects,efect have been discussed. The defect due to presence of flux residues has also been touched upon. The methods for mitigation/elimination of these defects have also been explained. A total of 45 live cases under 22 groups is presented.
harpsichord
发表于 2025-3-27 02:02:03
PCB Defects, defects on microsectioning of coupons of PCBs has been presented. This chapter illustrates the defects in PCBs through high-resolution photographic images. The methods for mitigation/elimination of these defects have also been explained. A total of 55 live cases under 18 groups are presented.
Mitigate
发表于 2025-3-27 07:40:35
Conformal Coating and Potting Defects,ed are illustrated. This includes entrapment of conformal coating material in undesired areas, splattering of material and missing coating. The method of inspection and acceptance criteria has been addressed. This chapter describes these defects through high-resolution photographic images.
Afflict
发表于 2025-3-27 10:26:19
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anchor
发表于 2025-3-27 15:35:54
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骑师
发表于 2025-3-27 17:46:49
Defects Due to the Usage of Non-FFF Components,ailures, inadequate coalescence of solder joints, room for foreign object material deposit, etc. Thus, every effort shall be made to see that replacement is done only with form, fit and functionally equivalent components. A total of 7 such typical cases have been captured and illustrated through high resolution photographs.
Valves
发表于 2025-3-27 23:09:53
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得意人
发表于 2025-3-28 02:20:04
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Arthritis
发表于 2025-3-28 07:01:43
https://doi.org/10.1007/978-3-662-62444-9g, undesired shorting, deviations from established routing methods, etc. Multiple level of verification preferably three-tier is recommended to be implemented so that no errors are left unaddressed and resolved. Automated methods for verification of CAD layouts need to be explored.
纵欲
发表于 2025-3-28 10:54:15
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