intrude
发表于 2025-3-30 09:07:03
http://reply.papertrans.cn/31/3065/306477/306477_51.png
scrutiny
发表于 2025-3-30 15:04:07
http://reply.papertrans.cn/31/3065/306477/306477_52.png
leniency
发表于 2025-3-30 16:44:35
Diamond Thin Films: Applications in Electronics Packaging,terial known to humanity, diamond scores high on almost all the categories of engineering properties such as thermal conductivity, electrical resistivity, and dielectric constant as summarized in Table 7.1. The combination of these outstanding properties makes diamond very attractive as the engineering material of tomorrow.