Kennedy
发表于 2025-3-21 19:35:24
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miracle
发表于 2025-3-21 21:09:46
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确定无疑
发表于 2025-3-22 01:59:16
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Injunction
发表于 2025-3-22 07:46:28
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SOB
发表于 2025-3-22 12:36:53
Recent Developments in Thermal Technology for Electronics Packaging,at transfer techniques. This has been especially true in the evolution of electronics packaging for digital computers. Since the development of the first electronic digital computers in the 1940s, the removal of heat has played a major role in ensuring their reliable operation. Early digital compute
dysphagia
发表于 2025-3-22 13:47:00
Diamond Thin Films: Applications in Electronics Packaging,terial known to humanity, diamond scores high on almost all the categories of engineering properties such as thermal conductivity, electrical resistivity, and dielectric constant as summarized in Table 7.1. The combination of these outstanding properties makes diamond very attractive as the engineer
dysphagia
发表于 2025-3-22 19:26:57
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Graduated
发表于 2025-3-22 21:25:46
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扩大
发表于 2025-3-23 03:35:05
Electrostatic and Electrical Overstress Damage in Silicon Mosfet Devices and Gaas Mesfet Structuresically financial) forces which continue to fuel this process have also brought about several technological advances. The reduction in transit time which results from reduced component size has led to improved gains and switching times . Smaller components require less external circuitry and,
miniature
发表于 2025-3-23 09:09:13
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