amphibian 发表于 2025-3-23 11:01:49
Electrical Bonding of Connectors on Jet Engine Electronics,s. The DC resistance between these connectors and their mounting surfaces must be less than 2.5 milliohms. Electronic control systems have experienced difficulty in meeting this bonding specification after environmental stress screening. The particular interface in question is between stainless stee暗指 发表于 2025-3-23 17:30:04
http://reply.papertrans.cn/31/3065/306477/306477_12.png沙文主义 发表于 2025-3-23 19:22:46
Microelectronics Packaging/Interconnect: An Industry in Transition,tial impact of changes in electronics packaging/interconnect on military systems. The findings and recommendations should be of interest to all the electronics community because the current modes of doing business in military electronics are expensive and opportunities for dual-use technology applicpaleolithic 发表于 2025-3-24 00:07:38
An Introduction to Tape Automated Bonding Technology, is placed upon a new understanding of the key elements (e.g., tapes, bumps, inner lead bonding, testing and burn-in on tape-with-chip, encapsulation, outer lead bonding, thermal management, reliability, etc.) of this rapidly moving technology.SSRIS 发表于 2025-3-24 04:46:35
http://reply.papertrans.cn/31/3065/306477/306477_15.pngexpansive 发表于 2025-3-24 07:51:17
Low Dielectric Constant Materials for Packaging High Speed Electronics,electric field; the dielectric strength defines a limiting electric field gradient above which the interaction of the dielectric with the field causes an irreversible change in the dielectric. Values of these properties for commercially important dielectric materials are shown in Table 8.1.过去分词 发表于 2025-3-24 12:20:21
Cleaning Surface Mount Assemblies: The Challenge of Finding a Substitute for CFC-113,, and ability to azeotrope (or boil as a compound at a single temperature) with other ingredients -- especially lower molecular weight alcohols and other select ingredients --s thus enhancing its solvency power for contaminant residues.发起 发表于 2025-3-24 15:35:13
Microelectronics Packaging/Interconnect: An Industry in Transition,ations could extend beyond the traditional military electronics industry. Some of the comments in this presentation are the author’s opinion only and may not represent the consensus position of either the Task Force or Allied-Signal.欲望小妹 发表于 2025-3-24 21:52:55
http://reply.papertrans.cn/31/3065/306477/306477_19.pngmaverick 发表于 2025-3-25 01:52:48
Manfred Nagl,Bernhard Westfechtel versus normal force was determined for the various configurations. The results show that electroplated nickel stainless steel connectors will meet the connector to engine control bonding resistance specification of 2.5 milliohms.