乌鸦
发表于 2025-3-21 17:41:12
书目名称Economics of Electronic Design, Manufacture and Test影响因子(影响力)<br> http://figure.impactfactor.cn/if/?ISSN=BK0301984<br><br> <br><br>书目名称Economics of Electronic Design, Manufacture and Test影响因子(影响力)学科排名<br> http://figure.impactfactor.cn/ifr/?ISSN=BK0301984<br><br> <br><br>书目名称Economics of Electronic Design, Manufacture and Test网络公开度<br> http://figure.impactfactor.cn/at/?ISSN=BK0301984<br><br> <br><br>书目名称Economics of Electronic Design, Manufacture and Test网络公开度学科排名<br> http://figure.impactfactor.cn/atr/?ISSN=BK0301984<br><br> <br><br>书目名称Economics of Electronic Design, Manufacture and Test被引频次<br> http://figure.impactfactor.cn/tc/?ISSN=BK0301984<br><br> <br><br>书目名称Economics of Electronic Design, Manufacture and Test被引频次学科排名<br> http://figure.impactfactor.cn/tcr/?ISSN=BK0301984<br><br> <br><br>书目名称Economics of Electronic Design, Manufacture and Test年度引用<br> http://figure.impactfactor.cn/ii/?ISSN=BK0301984<br><br> <br><br>书目名称Economics of Electronic Design, Manufacture and Test年度引用学科排名<br> http://figure.impactfactor.cn/iir/?ISSN=BK0301984<br><br> <br><br>书目名称Economics of Electronic Design, Manufacture and Test读者反馈<br> http://figure.impactfactor.cn/5y/?ISSN=BK0301984<br><br> <br><br>书目名称Economics of Electronic Design, Manufacture and Test读者反馈学科排名<br> http://figure.impactfactor.cn/5yr/?ISSN=BK0301984<br><br> <br><br>
fastness
发表于 2025-3-22 00:12:01
http://reply.papertrans.cn/31/3020/301984/301984_2.png
扔掉掐死你
发表于 2025-3-22 00:24:13
High Level Test Economics Advisor (Hi-TEA),ever, deciding on where and when to test and whether to apply Design For Test DFT) and Built-In Self-Test (BIST) at the IC, multichip module (MCM) or board level requires considerable study and evaluation to determine the economics of the various solutions and the payback. In this article we describ
规范要多
发表于 2025-3-22 04:55:17
Multichip Systems Trade-Off Analysis Tool,gn and manufacturing risks by allowing system designers to view the entire performance design space early in the design cycle prior to the initiation of traditional physical design activities..This article describes a software tool that performs interdisciplinary trade-off analysis and partitioning
矛盾心理
发表于 2025-3-22 12:23:14
Trade-off Analysis on Cost and Manufacturing Technology of an Electronic Product: Case Study,y comparing the system cost and packaging metrics with those of comparable consumer products, we have determined that there is opportunity for significant cost, size, and weight reduction of the overall electronics packaging system. These include the use of fine pitch IC packages, smaller discrete c
知道
发表于 2025-3-22 14:16:46
Cost Based Surface Mount PCB Design Evaluation,timating activities need to be speeded up. Consequently, the traditional gap between the designer who designs new products and the estimator who evaluates the financial consequences of the design is fading. Cost optimization is being integrated in the design process, and the designer needs to take m
知道
发表于 2025-3-22 20:17:31
Sensitivity Analysis in Economics Based Test Strategy Planning,at a few parameters—e.g., the gate count—need very detailed estimates, whereas the accuracy of many other parameters is insignificant in 99% of all cases. The techniques presented allow an in-depth evaluation of what is perceived as the main drawback in the use of economic modeling methods, namely,
荒唐
发表于 2025-3-23 00:35:31
http://reply.papertrans.cn/31/3020/301984/301984_8.png
MIRE
发表于 2025-3-23 05:00:55
Boundary Scan in Board Manufacturing,d is a composite of several actual products. Methods for effectively developing a boundary scan test are examined along with some of the advantages of approaching the development in unique ways. Additionally, the criteria for using these methods are developed. Results for test development time and t
门闩
发表于 2025-3-23 06:26:28
http://reply.papertrans.cn/31/3020/301984/301984_10.png