Simulate
发表于 2025-3-23 12:04:20
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creatine-kinase
发表于 2025-3-23 15:04:43
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B-cell
发表于 2025-3-23 20:32:04
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异端邪说2
发表于 2025-3-23 23:58:44
Boundary Scan in Board Manufacturing,he resulting test coverage show that with two weeks of test development using boundary scan it is possible to increase the rate of solder opens detection from 80% to 99% for a large ball-grid-array module.
Atmosphere
发表于 2025-3-24 06:13:17
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heterodox
发表于 2025-3-24 06:55:37
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不满分子
发表于 2025-3-24 11:22:50
,Vertikale Baugrubenabschlüsse,, for systems produced in low volumes, the adoption of full scan DFT can be more cost-effective than partial scan DFT when life-cycle costs are considered if it results in significant reductions in the time taken to get the product to market.
Palate
发表于 2025-3-24 18:05:23
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OTTER
发表于 2025-3-24 20:44:50
,Festigkeitseigenschaften der Böden,g. The analysis concluded that PCB area reduction of 40%, using a single PCB instead of three boards, reduction in board cost of over 50% and product weight reduction of over 28% are possible using available technologies.
APEX
发表于 2025-3-24 23:55:15
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