诽谤 发表于 2025-3-27 00:49:50

Anna Budzanowska,Tomasz Pietrzykowskivery 3 years, and logic devices and flash memory products, with 32-nm-level minimum feature sizes, were in volume production as of 2011. Some 28-nm production devices are also available as of this writing.

死亡率 发表于 2025-3-27 02:09:51

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现代 发表于 2025-3-27 08:12:59

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FACT 发表于 2025-3-27 13:11:47

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APNEA 发表于 2025-3-27 17:07:51

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Postulate 发表于 2025-3-27 19:38:08

https://doi.org/10.1007/978-3-030-36460-1ious issue at the 32-nm node and beyond. Furthermore, the discussion includes a review of the double-patterning technology, which is the hot topic of the moment, and three-dimensional integrated circuit (3D IC) etching for the 16-nm node and beyond.

压倒 发表于 2025-3-27 22:09:22

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感染 发表于 2025-3-28 06:10:43

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ILEUM 发表于 2025-3-28 09:34:33

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Outshine 发表于 2025-3-28 12:55:38

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查看完整版本: Titlebook: Dry Etching Technology for Semiconductors; Kazuo Nojiri Book 2015 Springer International Publishing Switzerland 2015 3D Integrated Circuit