演讲
发表于 2025-3-26 22:28:40
Electromigration in Cu Thin Films,the formation of voids or extrusions, resulting in failure of the chips. Electromigration in Al(Cu) thin films has been a subject of extensive studies for several decades.[.–.] Investigators have reported that electromigration in Al thin-film lines is related to grain boundary diffusion,[.] interfac
agonist
发表于 2025-3-27 01:54:17
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Adenocarcinoma
发表于 2025-3-27 06:02:54
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施加
发表于 2025-3-27 10:41:49
Atomistic Computer Simulation of Diffusion,long with continuum modeling aimed at describing diffusion processes by differential equations, atomic-level modeling is playing an increasingly important role as a means of gaining fundamental insights into diffusion phenomena.
Malleable
发表于 2025-3-27 15:52:49
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不如屎壳郎
发表于 2025-3-27 21:32:12
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SEVER
发表于 2025-3-28 00:44:26
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乞丐
发表于 2025-3-28 04:34:09
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宽大
发表于 2025-3-28 09:57:52
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Vulvodynia
发表于 2025-3-28 12:24:51
https://doi.org/10.1007/978-94-017-2868-3relation factor .=lattice parameter .=jump frequency Δ.*=activation entropy Δ.*=activation enthalpy .=universal gas constant .=temperature, in degrees Kelvin Furthermore, the enthalpy and free energy (Δ.*)of activation for diffusion are given by: