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978-1-4899-8696-2Springer Science+Business Media New York 2013ingestion 发表于 2025-3-31 08:28:43
General Principles of Preoperative Planningicant silicon area due to their sheer size, which has a great effect on the power and performance of 3D ICs. Whereas well-managed TSVs alleviate routing congestion, reduce wirelength, and improve performance, excessive or ill-managed TSVs not only increase the die area but also degrade performance a