留恋 发表于 2025-3-30 09:40:08

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intuition 发表于 2025-3-30 19:56:01

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ANTIC 发表于 2025-3-30 23:31:27

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acetylcholine 发表于 2025-3-31 01:29:04

978-1-4899-8696-2Springer Science+Business Media New York 2013

ingestion 发表于 2025-3-31 08:28:43

General Principles of Preoperative Planningicant silicon area due to their sheer size, which has a great effect on the power and performance of 3D ICs. Whereas well-managed TSVs alleviate routing congestion, reduce wirelength, and improve performance, excessive or ill-managed TSVs not only increase the die area but also degrade performance a
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查看完整版本: Titlebook: Design for High Performance, Low Power, and Reliable 3D Integrated Circuits; Sung Kyu Lim Book 2013 Springer Science+Business Media New Yo