Panacea
发表于 2025-3-26 22:36:42
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jabber
发表于 2025-3-27 02:52:54
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Ethics
发表于 2025-3-27 06:09:39
Chip/Package Co-analysis of Mechanical Stress for 3D ICons and reliability analysis. Finally, we study the mechanical reliability issues in practical 3D chip/package designs including wide-I/O and block-level 3D ICs..The materials presented in this chapter are based on .
Myocyte
发表于 2025-3-27 11:23:41
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温室
发表于 2025-3-27 16:10:32
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雄辩
发表于 2025-3-27 21:23:25
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grenade
发表于 2025-3-28 00:36:26
Regular Versus Irregular TSV Placement for 3D ICicant silicon area due to their sheer size, which has a great effect on the power and performance of 3D ICs. Whereas well-managed TSVs alleviate routing congestion, reduce wirelength, and improve performance, excessive or ill-managed TSVs not only increase the die area but also degrade performance a
过份艳丽
发表于 2025-3-28 04:15:31
Steiner Routing for 3D ICtruction and tree refinement. Our tree construction algorithm builds a delay-oriented Steiner tree under a given thermal profile. We show that our 3D tree construction involves minimization of two-variable Elmore delay function. In our tree refinement algorithm, we reposition the through-silicon-via
旧石器
发表于 2025-3-28 08:52:43
Buffer Insertion for 3D IC study the fact that Through-Silicon-Vias (TSVs) have large parasitic capacitances that increase signal slew. Next, we develop a buffer insertion algorithm that improves the delay of both 3D and 2D nets in a 3D IC with explicit consideration of signal slew. The effectiveness of this technique is dem
大气层
发表于 2025-3-28 14:09:40
Low Power Clock Routing for 3D IC ICs). First, we study the impact of the TSV count and the TSV RC parasitics on clock power consumption. Several techniques are introduced to reduce the clock power consumption and slew of the 3D clock distribution network. We analyze how these design factors affect the overall wirelength, clock pow