非秘密 发表于 2025-3-25 07:02:01

Fourier and Fourier-Mehler Transforms,cale integration (ULSI) technologies. Depositions were performed in a lamp heated cold-wall rapid thermal processor (rapid thermal chemical vapor deposition -RTCVD) using thermal decomposition of GeH. and SiH.Cl. in a carrier gas of H.. The process is a relatively low temperature/high throughput pro

somnambulism 发表于 2025-3-25 10:31:36

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ALIEN 发表于 2025-3-25 12:58:16

ls. Since the ternary and quaternary alloys play a major part in the topic, we focus on specific issues, especially in terms of thermodynamics, related to alloys. An insight is given on recent developments: strained epilayers and quantum wells. We then review the materials of interest for optoelectr

大笑 发表于 2025-3-25 16:44:35

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苍白 发表于 2025-3-25 23:52:22

Main, Haul-Back and Hoist Lines,s of performance has produced encounters with some fundamental limits of materials processing. This paper examines the role of materials processing in defining the ultimate limits in feature size, compositional and structural heterogeneity, and device performance. Particular emphasis is given to sil

胖人手艺好 发表于 2025-3-26 01:06:12

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ironic 发表于 2025-3-26 04:59:56

The History of Rope Transportation, (DLTS) and current-voltage (IV) measurements. For both undecorated and Fe-decorated stacking faults similar deep level spectra were found with a dominant level at Ev+0.5 eV. For diodes with decorated stacking faults the IV-measurements reveal a drastic enhancement of the reverse current which corre

induct 发表于 2025-3-26 08:51:28

Scaling for Convective Boundary Layers gradient. This defect configuration shows persistent photoionisation and it is associated with the so-called “DX-center”. The time constant of the relaxation from the substitutional donor-site to the DX-center defect site is measured.

禁止,切断 发表于 2025-3-26 15:45:02

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无瑕疵 发表于 2025-3-26 17:20:24

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查看完整版本: Titlebook: Crucial Issues in Semiconductor Materials and Processing Technologies; S. Coffa,F. Priolo,J. M. Poate Book 1992 Springer Science+Business