临时抱佛脚 发表于 2025-3-23 13:16:24
0168-132X integrated circuits is increasing considerably because ofthe continuous dimensional shrinkage to improve efficiency andfunctionality. This evolution in design rules poses real challengesfor the materials scientists and processing engineers. Materials,defects and processing now have to be understood锯齿状 发表于 2025-3-23 17:03:17
d to alloys. An insight is given on recent developments: strained epilayers and quantum wells. We then review the materials of interest for optoelectronic devices and detail those related to telecommunication applications, especially the InGaAsP and InGaAlAs quaternary systems.Tracheotomy 发表于 2025-3-23 21:53:51
rmal annealing in nitrogen were also shown. The experimental data can be interpreted in terms of the contributions of insulator-related structural defects and semiconductor-related defects induced by the plasma deposition process on the crystal surface.covert 发表于 2025-3-24 00:37:53
http://reply.papertrans.cn/25/2405/240468/240468_14.pngingenue 发表于 2025-3-24 03:33:57
Anchors, Spars and Intermediate Supports,l oxygen in the epitaxial layer, clearly indicating that solid state outdiffusion from the substrate occurs during film preparation. Furthermore the major consequence of outdiffusion, e.g. oxygen contamination of the epitaxial layer has been shown to produce precipitation phenomena inside the film, directly influencing its quality.Ascendancy 发表于 2025-3-24 07:37:14
http://reply.papertrans.cn/25/2405/240468/240468_16.pngheirloom 发表于 2025-3-24 11:39:57
http://reply.papertrans.cn/25/2405/240468/240468_17.png向前变椭圆 发表于 2025-3-24 16:26:10
http://reply.papertrans.cn/25/2405/240468/240468_18.png或者发神韵 发表于 2025-3-24 19:51:30
http://reply.papertrans.cn/25/2405/240468/240468_19.pngDebility 发表于 2025-3-25 02:32:26
Applications to Quantum Field Theory, revolution in the properties attainable in devices fabricated using these new growth techniques. This paper will present several key advances in materials preparation, and the application of this work.