不朽中国 发表于 2025-3-25 06:11:51

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假装是你 发表于 2025-3-25 10:15:36

Coping and Living with Cervical Cancer,c material) to separate the .. Besides being an insulating material for interconnecting lines, SiO. has been used also as a gate material in metal oxide semiconductor (MOS) devices. As a matter of fact, Al coupled with SiO. has become the workhorse of IC technology.

预示 发表于 2025-3-25 13:34:51

Coping and Living with Cervical Cancer,et (DUV) lithography. Figure 4.1 shows a picture of the trenches produced by using DUV resist and phase-shift mask (PSM). The resist images show a .. factor as small as 0.25 (the 2004 ITRS requirement for technology node is . and is expected to be . by the year 2007, where .).

mighty 发表于 2025-3-25 16:58:22

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折磨 发表于 2025-3-25 21:08:09

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PAC 发表于 2025-3-26 02:50:46

Coping and Living with Cervical Cancer, Cu is difficult and photoresist work cannot withstand the temperatures required for Cu-etching (>200 ºC). Moreover, wet etching and lift-off techniques of Cu have been attempted without much success. So a new process technology known as the . process has been introduced to integrate Cu-interconnects in modern integrated circuits (ICs).

凹槽 发表于 2025-3-26 04:38:12

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obviate 发表于 2025-3-26 09:31:29

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PLAYS 发表于 2025-3-26 16:28:38

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Mettle 发表于 2025-3-26 20:28:58

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查看完整版本: Titlebook: Copper Interconnect Technology; Tapan Gupta Book 2009 Springer-Verlag New York 2009 circuit performance.copper/low-k technology.cu interco