concubine 发表于 2025-3-27 00:33:17

Dielectric Materials,n sub-100 nm devices. With rapidly . and more demand for circuit ., low-. and passivation materials have been inserted with Cu-interconnects to address the additional . reduction [.–.]. Unfortunately, as the thickness of the gate oxide becomes very thin because of the scaling down of channel length,

FEAT 发表于 2025-3-27 03:17:38

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CRAMP 发表于 2025-3-27 08:19:01

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Commodious 发表于 2025-3-27 11:02:01

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persistence 发表于 2025-3-27 14:38:58

The Copper Damascene Process and Chemical Mechanical Polishing, in Damascus, a city notable for manufacturing and shipment of damascened steel sword blades, which were exceptionally hard and resilient. In French, damascene is . means to decorate in the manner of Damascus blades or steel from Damasquine of Damascus. Thus the word . can be taken literally as the

CRP743 发表于 2025-3-27 20:41:54

Conduction and Electromigration,ed capacitive reactance of the interconnecting lines. The conductivity of copper (σ. = 0.598 ohm-cm and σ . = 0.374 ohm-cm) is higher and it offers higher resistance to electromigration (EM) compared to aluminum (or Al-alloy). At the same time, copper has the advantage of making finer wires with low

graphy 发表于 2025-3-27 22:08:48

Book 1970actors have contributed to this: 1) the dissemination of more accurate information about the surgical anatomy of the intrin­ sic and extrinsic hepatic circulatory systems, which has acquainted surgeons with the principles and techniques of hemostasis essential for successful operative intervention o

金桌活画面 发表于 2025-3-28 03:12:10

Risiken und Chancen,en wie auch die Risiken entsprechender Techniken ergeben sich nicht allgemein aus der Technik, sondern müssen stets vor dem Hintergrund der geplanten Verwendung eines Systems gesehen werden. Daher werden die Chancen und Risiken nur allgemein beschrieben, wobei die Nutzung der Technik im Krisen- und Infrastrukturmanagement den Fokus bilden soll.

教育学 发表于 2025-3-28 10:04:49

e surgeries of the world renowned Skull Base Institute.IncluI am honored to be asked to write a foreword to this comprehensive and fascinating book on skull base surgery (SBS) by Dr. Shahinian, who I consider among the pioneers in the field. I should start by writing a disclaimer. I first met Dr. Sh

COWER 发表于 2025-3-28 10:52:46

erschienen sind. Der Verlag stellt mit diesem Archiv Quellen für die historische wie auch die disziplingeschichtliche Forschung zur Verfügung, die jeweils im historischen Kontext betrachtet werden müssen. Dieser Titel erschien in der Zeit vor 1945 und wird daher in seiner zeittypischen politisch-ide
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查看完整版本: Titlebook: Copper Interconnect Technology; Tapan Gupta Book 2009 Springer-Verlag New York 2009 circuit performance.copper/low-k technology.cu interco