笔记 发表于 2025-3-21 16:48:58

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cumulative 发表于 2025-3-21 22:34:32

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Confidential 发表于 2025-3-22 04:18:55

Platform Technologies for Pico-liter Printing and Nano-imprintingt high density on circuit boards, microtechnically manufactured optical benches, or NEMS. For such tasks, appropriate platform technologies are already available (Table 11.1). This chapter will introduce design and properties of the respective equipment.

cancellous-bone 发表于 2025-3-22 05:33:42

Nanoparticle-Based Resistors and Conductorsacy on top of components with almost any geometry. Additionally, the alignment of filler particles in an electric field by dielectrophoresis is discussed in detail. This technique enables a high conductivity of the composite at a low filling degree and in general a precise adjustment of the electric

ABOUT 发表于 2025-3-22 11:56:11

Bio and Nano Packaging Techniques for Electron DevicesAdvances in Electron

minimal 发表于 2025-3-22 16:35:07

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休战 发表于 2025-3-22 18:37:44

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BIBLE 发表于 2025-3-22 21:22:55

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Glycogen 发表于 2025-3-23 03:43:11

Koen Lemmink,Michel Brink,Esther Nederhoft high density on circuit boards, microtechnically manufactured optical benches, or NEMS. For such tasks, appropriate platform technologies are already available (Table 11.1). This chapter will introduce design and properties of the respective equipment.

forecast 发表于 2025-3-23 07:27:27

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查看完整版本: Titlebook: Bio and Nano Packaging Techniques for Electron Devices; Advances in Electron Gerald Gerlach,Klaus-Jürgen Wolter Book 2012 Springer-Verlag B