范例 发表于 2025-3-23 13:18:29

ogies with high potential for industrial applications are discussed. The book brings together a comprehensive overview of nano scale components and systems comprising electronic, mechanical and optical structures and serves as important reference for industrial and academic researchers..978-3-642-44286-5978-3-642-28522-6

Cholecystokinin 发表于 2025-3-23 15:49:26

https://doi.org/10.1007/978-3-642-28522-63D Modelling; Bio-Functionalized Surfaces; Biocompatible Packaging; MEMS; MOEMS; Metallization; NEMS; Nano-

亲密 发表于 2025-3-23 18:54:12

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BET 发表于 2025-3-23 23:22:27

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蜿蜒而流 发表于 2025-3-24 02:40:18

Produktnutzen und Zielgruppe definieren will be given and the requirements for System in Package (SiP), followed up by More-than-Moore approaches leading to Hetero-System-Integration. One focus of this chapter will lie on the three-dimensional (3D) integration in electronic packages, their assembly and interconnection technologies. This

Jejune 发表于 2025-3-24 07:22:17

https://doi.org/10.1007/978-3-658-23959-6nvironment in order to constitute systems with particular complex functions, that match the system to the environment given by the intended application and that secures and maintains the systems properties during entire life-time. It provides the structural scaffold and framework for the functional

悄悄移动 发表于 2025-3-24 12:31:46

https://doi.org/10.1007/978-3-658-23959-6ntain the validity of Moore’s law in today’s nano era. In this chapter, an overview of technologies and physical design in the new 3-dimensional context is presented. A survey of modern 3D integration technologies, such as 3D packages and 3D integrated circuits, is given first. The author then inves

otic-capsule 发表于 2025-3-24 14:57:11

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窝转脊椎动物 发表于 2025-3-24 23:00:11

Natural History of JSRV in Sheep,rking principles and the manufacturing technology associated with high initial costs for experimental investigations. Uncertainty-based design optimization enables stochastic variables, such as scattering material properties, manufacturing tolerances, stochastic time dependent loads, aging, or wear,

极大的痛苦 发表于 2025-3-25 03:09:12

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查看完整版本: Titlebook: Bio and Nano Packaging Techniques for Electron Devices; Advances in Electron Gerald Gerlach,Klaus-Jürgen Wolter Book 2012 Springer-Verlag B