笔记
发表于 2025-3-21 16:48:58
书目名称Bio and Nano Packaging Techniques for Electron Devices影响因子(影响力)<br> http://impactfactor.cn/2024/if/?ISSN=BK0186319<br><br> <br><br>书目名称Bio and Nano Packaging Techniques for Electron Devices影响因子(影响力)学科排名<br> http://impactfactor.cn/2024/ifr/?ISSN=BK0186319<br><br> <br><br>书目名称Bio and Nano Packaging Techniques for Electron Devices网络公开度<br> http://impactfactor.cn/2024/at/?ISSN=BK0186319<br><br> <br><br>书目名称Bio and Nano Packaging Techniques for Electron Devices网络公开度学科排名<br> http://impactfactor.cn/2024/atr/?ISSN=BK0186319<br><br> <br><br>书目名称Bio and Nano Packaging Techniques for Electron Devices被引频次<br> http://impactfactor.cn/2024/tc/?ISSN=BK0186319<br><br> <br><br>书目名称Bio and Nano Packaging Techniques for Electron Devices被引频次学科排名<br> http://impactfactor.cn/2024/tcr/?ISSN=BK0186319<br><br> <br><br>书目名称Bio and Nano Packaging Techniques for Electron Devices年度引用<br> http://impactfactor.cn/2024/ii/?ISSN=BK0186319<br><br> <br><br>书目名称Bio and Nano Packaging Techniques for Electron Devices年度引用学科排名<br> http://impactfactor.cn/2024/iir/?ISSN=BK0186319<br><br> <br><br>书目名称Bio and Nano Packaging Techniques for Electron Devices读者反馈<br> http://impactfactor.cn/2024/5y/?ISSN=BK0186319<br><br> <br><br>书目名称Bio and Nano Packaging Techniques for Electron Devices读者反馈学科排名<br> http://impactfactor.cn/2024/5yr/?ISSN=BK0186319<br><br> <br><br>
cumulative
发表于 2025-3-21 22:34:32
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Confidential
发表于 2025-3-22 04:18:55
Platform Technologies for Pico-liter Printing and Nano-imprintingt high density on circuit boards, microtechnically manufactured optical benches, or NEMS. For such tasks, appropriate platform technologies are already available (Table 11.1). This chapter will introduce design and properties of the respective equipment.
cancellous-bone
发表于 2025-3-22 05:33:42
Nanoparticle-Based Resistors and Conductorsacy on top of components with almost any geometry. Additionally, the alignment of filler particles in an electric field by dielectrophoresis is discussed in detail. This technique enables a high conductivity of the composite at a low filling degree and in general a precise adjustment of the electric
ABOUT
发表于 2025-3-22 11:56:11
Bio and Nano Packaging Techniques for Electron DevicesAdvances in Electron
minimal
发表于 2025-3-22 16:35:07
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休战
发表于 2025-3-22 18:37:44
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BIBLE
发表于 2025-3-22 21:22:55
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Glycogen
发表于 2025-3-23 03:43:11
Koen Lemmink,Michel Brink,Esther Nederhoft high density on circuit boards, microtechnically manufactured optical benches, or NEMS. For such tasks, appropriate platform technologies are already available (Table 11.1). This chapter will introduce design and properties of the respective equipment.
forecast
发表于 2025-3-23 07:27:27
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