infringe 发表于 2025-3-23 09:42:52

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arthrodesis 发表于 2025-3-23 16:43:07

Submitted on: 06 January 2021.
Revised on: 15 February 2021.
Accepted on: 29 March 2021.

___________________JOURNAL OF ELECTRONIC PACKAGING

impaction 发表于 2025-3-23 18:45:17

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Spinal-Tap 发表于 2025-3-23 23:42:39

Submitted on: 29 February 2024.
Revised on: 09 April 2024.
Accepted on: 26 April 2024.

___________________JOURNAL OF ELECTRONIC PACKAGING

暂时休息 发表于 2025-3-24 05:10:21

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archetype 发表于 2025-3-24 09:38:24

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千篇一律 发表于 2025-3-24 13:03:54

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厨师 发表于 2025-3-24 16:36:17

Submitted on: 07 April 2015.
Revised on: 23 July 2015.
Accepted on: 19 August 2015.

___________________JOURNAL OF ELECTRONIC PACKAGING

Creditee 发表于 2025-3-24 21:07:37

Submitted on: 07 June 2013.
Revised on: 21 July 2013.
Accepted on: 18 September 2013.

___________________JOURNAL OF ELECTRONIC PACKAGING

出汗 发表于 2025-3-25 01:30:56

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查看完整版本: SCIE期刊JOURNAL OF ELECTRONIC PACKAGING 2024/2025影响因子:2.203 (J ELECTRON PACKAGING) (1043-7398). (ENGINEERING, ELECTRICAL