嘲弄 发表于 2025-3-26 22:42:55

Submitted on: 07 July 2004.
Revised on: 28 August 2004.
Accepted on: 14 October 2004.

___________________JOURNAL OF ELECTRONIC PACKAGING

卷发 发表于 2025-3-27 03:28:20

Submitted on: 24 September 2021.
Revised on: 21 January 2022.
Accepted on: 13 March 2022.

___________________JOURNAL OF ELECTRONIC PACKAGING

FRAX-tool 发表于 2025-3-27 08:18:13

Submitted on: 30 December 2019.
Revised on: 18 March 2020.
Accepted on: 07 April 2020.

___________________JOURNAL OF ELECTRONIC PACKAGING

刻苦读书 发表于 2025-3-27 10:14:34

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大厅 发表于 2025-3-27 14:54:00

Submitted on: 08 June 2024.
Revised on: 19 August 2024.
Accepted on: 04 September 2024.

___________________JOURNAL OF ELECTRONIC PACKAGING

背叛者 发表于 2025-3-27 20:17:50

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查看完整版本: SCIE期刊JOURNAL OF ELECTRONIC PACKAGING 2024/2025影响因子:2.203 (J ELECTRON PACKAGING) (1043-7398). (ENGINEERING, ELECTRICAL