浅吟低唱
发表于 2025-3-21 17:56:06
书目名称Wafer-Level Chip-Scale Packaging影响因子(影响力)<br> http://figure.impactfactor.cn/if/?ISSN=BK1020140<br><br> <br><br>书目名称Wafer-Level Chip-Scale Packaging影响因子(影响力)学科排名<br> http://figure.impactfactor.cn/ifr/?ISSN=BK1020140<br><br> <br><br>书目名称Wafer-Level Chip-Scale Packaging网络公开度<br> http://figure.impactfactor.cn/at/?ISSN=BK1020140<br><br> <br><br>书目名称Wafer-Level Chip-Scale Packaging网络公开度学科排名<br> http://figure.impactfactor.cn/atr/?ISSN=BK1020140<br><br> <br><br>书目名称Wafer-Level Chip-Scale Packaging被引频次<br> http://figure.impactfactor.cn/tc/?ISSN=BK1020140<br><br> <br><br>书目名称Wafer-Level Chip-Scale Packaging被引频次学科排名<br> http://figure.impactfactor.cn/tcr/?ISSN=BK1020140<br><br> <br><br>书目名称Wafer-Level Chip-Scale Packaging年度引用<br> http://figure.impactfactor.cn/ii/?ISSN=BK1020140<br><br> <br><br>书目名称Wafer-Level Chip-Scale Packaging年度引用学科排名<br> http://figure.impactfactor.cn/iir/?ISSN=BK1020140<br><br> <br><br>书目名称Wafer-Level Chip-Scale Packaging读者反馈<br> http://figure.impactfactor.cn/5y/?ISSN=BK1020140<br><br> <br><br>书目名称Wafer-Level Chip-Scale Packaging读者反馈学科排名<br> http://figure.impactfactor.cn/5yr/?ISSN=BK1020140<br><br> <br><br>
Obstreperous
发表于 2025-3-21 21:37:35
Stackable Wafer-Level Analog Chip-Scale Package,ally mentioned as well. More frequently, heat dissipation is one of the mostly concerned areas for the stacked package. Cost of manufacturing the 3D structure seems to be the main hurdle for wider adoptions of the more aggressive 3D package concepts.
fiction
发表于 2025-3-22 03:46:07
WLCSP Typical Reliability and Test, reliability requirements; the metal stack (UBM and the Al pad), passivation, or polyimide may also appear to fail, especially when the WLCSP is mounted on the PCB. The board level reliability is a big concern for both analog and power WLCSP packaging. This chapter will discuss the WLCSP typical reliability test.
HARD
发表于 2025-3-22 05:40:07
WLCSP Typical Reliability and Test, reliability requirements; the metal stack (UBM and the Al pad), passivation, or polyimide may also appear to fail, especially when the WLCSP is mounted on the PCB. The board level reliability is a big concern for both analog and power WLCSP packaging. This chapter will discuss the WLCSP typical reliability test.
高歌
发表于 2025-3-22 10:55:19
http://reply.papertrans.cn/103/10202/1020140/1020140_5.png
皱痕
发表于 2025-3-22 13:45:48
Demand and Challenges for Wafer-Level Chip-Scale Analog and Power Packaging,miconductor industry. This chapter covers in more detail how advances in both the analog and power advanced wafer-level package fan-in/fan-out design and 3D integration have co-enabled significant advances in analog and power device capability during recent years. Extrapolating the same trends in re
Cloudburst
发表于 2025-3-22 19:15:35
Fan-In Wafer-Level Chip-Scale Package,as wire bond devices with bond pads all arranged along the perimeters of semiconductor dies. When converting a perimeter bond pad design into an area array WLCSP, redistribution or “fan-in” technology had to be used.
Keshan-disease
发表于 2025-3-23 00:24:33
Fan-In Wafer-Level Chip-Scale Package,as wire bond devices with bond pads all arranged along the perimeters of semiconductor dies. When converting a perimeter bond pad design into an area array WLCSP, redistribution or “fan-in” technology had to be used.
miniature
发表于 2025-3-23 02:28:48
http://reply.papertrans.cn/103/10202/1020140/1020140_9.png
Veneer
发表于 2025-3-23 07:22:23
http://reply.papertrans.cn/103/10202/1020140/1020140_10.png