不舒服
发表于 2025-3-23 13:09:56
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Torrid
发表于 2025-3-23 14:58:44
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合群
发表于 2025-3-23 20:48:16
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Innocence
发表于 2025-3-23 23:33:23
Wafer-Level Discrete Power Mosfet Package Design,de various diodes, bipolars, metal–oxide semiconductor field-effect transistors (Mosfets), and insulated gate bipolar transistor (IGBTs). As the needs of miniaturization, one trend of the discrete power Mosfet packages is to move the discrete power devices into various wafer-level chip-scale package
Cholagogue
发表于 2025-3-24 04:32:31
Wafer-Level Packaging TSV/Stack Die for Integration of Analog and Power Solution,few years ago are today commonplace thanks in part to advances in WLCSP electronic package design. From portable applications such as in mobile telecommunications to consumer electronics, each imposes its own individual demands on the development of WLCSP. To meet such a diverse range of application
zonules
发表于 2025-3-24 10:16:50
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Exonerate
发表于 2025-3-24 12:46:55
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sinoatrial-node
发表于 2025-3-24 17:17:48
Thermal Management, Design, and Analysis for WLCSP,the device does not operate in a normal way. It is also well known that the failure rates of semiconductor devices increase exponentially as the junction temperature rises. Figure 7.1 shows a FLIR camera image of temperature distribution inside a smart phone, which gives the sources of heat dissipat
言行自由
发表于 2025-3-24 19:45:56
Electrical and Multiple Physics Simulation for Analog and Power WLCSP, electrical performance of different devices, effect of assembly reflow process on electrical properties, and the resistance of a solder joint, have been done to improve a product’s electrical performance . In recent years, the investigation for the electrical performance of a WLCSP has been pa
补角
发表于 2025-3-25 00:40:19
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