miracle
发表于 2025-3-26 22:23:09
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LATER
发表于 2025-3-27 01:28:48
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纤细
发表于 2025-3-27 07:19:11
Wafer-Scale Multichip Packaging Technology,With the many difficulties facing monolithic wafer-scale integration, there has been a significant amount of recent activity focusing on thin-film, multichip packaging approaches utilizing silicon wafers for the substrate. The breadth of these activities can be seen in Table 1, from Hagge .
依法逮捕
发表于 2025-3-27 13:06:28
978-1-4612-8896-1Kluwer Academic Publishers 1989
食草
发表于 2025-3-27 16:16:42
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KEGEL
发表于 2025-3-27 19:05:14
https://doi.org/10.1007/978-1-4613-1621-3Programmable Logic; Signal; Software; VLSI; Wafer; computer vision; development; diagnosis; integrated circu
领导权
发表于 2025-3-27 23:30:42
Promise and Pitfalls of WSI,d then, like the phoenix, a new set of innovators and investors rise from the ashes to make yet another attempt. By itself, this very process is informative. Talented people do not invest their time and money in ill conceived enterprises. They believed the risks could be managed, and that the prize was worth the effort.
字的误用
发表于 2025-3-28 04:04:41
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Locale
发表于 2025-3-28 06:28:01
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Instinctive
发表于 2025-3-28 11:20:46
Architectural Yield Optimization,ductor researchers . The expected benefits of smaller size, increased reliability, reduced cost, shorter signal delays, and simpler packaging are significant. Unfortunately, most of the previously reported attempts have been surpassed by increased density, improved circuitry, and better packaging of conventional integrated circuits.