miracle
发表于 2025-4-1 05:54:46
Wafer-Scale Testing/Design for Testability,ies. As digital systems become more complex, they are characterized by more internal circuitry per I/O line and larger internal state spaces. This makes testing complex systems as integrated units very difficult. The testing problem can be made more tractable by partitioning them into subsystems tha
ENDOW
发表于 2025-4-1 06:28:50
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无能力之人
发表于 2025-4-1 11:24:32
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cuticle
发表于 2025-4-1 16:59:04
The 3-D Computer: An Integrated Stack of WSI Wafers,pany higher levels of integration have been the driving constraints. In virtually all instances, though, the end goal has been the same: increase the packaging density of the active electronic elements.
Nonthreatening
发表于 2025-4-1 19:15:33
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诱惑
发表于 2025-4-2 01:15:12
afer with hundreds of identical circuits, testing the circuits, dicing the wafer, and packaging the good dice. In contrast in WSI, a wafer is fabricated with several types of circuits (generally referred to as cells), with multiple instances of each cell type, the cells are tested, and good cells ar