偏狂症
发表于 2025-3-27 00:12:04
Microstructure and Mechanical Properties of Solder Alloys, the resistance of the joint to mechanical rupture under short-term direct loading, as might occur during impact testing. If the solder joint is subjected to cyclic stresses and strains generated by thermal expansions during thermal cycling, the reliability depends on resistance to fatigue. Because
atrophy
发表于 2025-3-27 03:30:08
http://reply.papertrans.cn/88/8715/871492/871492_32.png
Blatant
发表于 2025-3-27 08:29:30
http://reply.papertrans.cn/88/8715/871492/871492_33.png
Pander
发表于 2025-3-27 13:18:23
http://reply.papertrans.cn/88/8715/871492/871492_34.png
AVOW
发表于 2025-3-27 15:47:50
Predicting Thermal and Mechanical Fatigue Lives from Isothermal Low Cycle Data, component to the board. With surface mounting, the joints serve as the mechanical as well as the electrical connection for the component. As such, they must accommodate any relative displacement between the component and the board and support the stresses that are developed by this displacement.
改革运动
发表于 2025-3-27 18:37:54
http://reply.papertrans.cn/88/8715/871492/871492_36.png
accomplishment
发表于 2025-3-28 01:38:14
http://reply.papertrans.cn/88/8715/871492/871492_37.png
有偏见
发表于 2025-3-28 02:05:31
http://reply.papertrans.cn/88/8715/871492/871492_38.png
Genome
发表于 2025-3-28 09:04:04
Book 1991mponents. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as wel
600
发表于 2025-3-28 13:31:07
http://reply.papertrans.cn/88/8715/871492/871492_40.png