Fruition
发表于 2025-3-21 17:10:57
书目名称Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits影响因子(影响力)<br> http://figure.impactfactor.cn/if/?ISSN=BK0867538<br><br> <br><br>书目名称Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits影响因子(影响力)学科排名<br> http://figure.impactfactor.cn/ifr/?ISSN=BK0867538<br><br> <br><br>书目名称Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits网络公开度<br> http://figure.impactfactor.cn/at/?ISSN=BK0867538<br><br> <br><br>书目名称Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits网络公开度学科排名<br> http://figure.impactfactor.cn/atr/?ISSN=BK0867538<br><br> <br><br>书目名称Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits被引频次<br> http://figure.impactfactor.cn/tc/?ISSN=BK0867538<br><br> <br><br>书目名称Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits被引频次学科排名<br> http://figure.impactfactor.cn/tcr/?ISSN=BK0867538<br><br> <br><br>书目名称Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits年度引用<br> http://figure.impactfactor.cn/ii/?ISSN=BK0867538<br><br> <br><br>书目名称Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits年度引用学科排名<br> http://figure.impactfactor.cn/iir/?ISSN=BK0867538<br><br> <br><br>书目名称Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits读者反馈<br> http://figure.impactfactor.cn/5y/?ISSN=BK0867538<br><br> <br><br>书目名称Simulation Techniques and Solutions for Mixed-Signal Coupling in Integrated Circuits读者反馈学科排名<br> http://figure.impactfactor.cn/5yr/?ISSN=BK0867538<br><br> <br><br>
Myocyte
发表于 2025-3-21 22:31:56
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regale
发表于 2025-3-22 03:06:06
Controlling Substrate Coupling in Heavily-Doped Bulk Processes,roportional to the total chip switching power as well as to the logic power rail inductance and chip substrate tie inductance. Coupled noise peak voltages are frequency dependent, unlike the coupled energy, due to constructive and destructive interference of the various frequencies.
INCUR
发表于 2025-3-22 06:39:26
Chip/Package Shielding and Good Circuit Design Practice,e usual definition of far field radiated noise isthat the distance from source.Antenna length, L~> λ (wavelength) for an EFFICIENT antenna.A “rule of thumb” to minimize radiated emissions is to keep the chip package linear dimensions.and to keep the chip/package.▪ An example:
gustation
发表于 2025-3-22 11:35:42
Introduction,equired to combine significant portions of analog circuits with the purely digital switching functions. Current IC and packaging geometries have been miniaturized to the point that, at high speeds, even pure CMOS logic designs are being limited by crosstalk and inductive switching noise problems. Ad
Sciatica
发表于 2025-3-22 15:39:28
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Compassionate
发表于 2025-3-22 17:33:15
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Blood-Vessels
发表于 2025-3-22 22:21:21
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LAITY
发表于 2025-3-23 02:23:18
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谄媚于性
发表于 2025-3-23 05:32:24
,,e node model for such substrates is that, once characterized for a particular process it can readily be used for any circuit structure that uses the same process, irrespective of size. Unfortunately the model does not extend to processes which do not have a heavily-doped bulk which is in effect a co