acclimate
发表于 2025-3-28 16:43:24
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来就得意
发表于 2025-3-28 21:04:47
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ABYSS
发表于 2025-3-28 23:34:36
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外观
发表于 2025-3-29 06:23:47
Fan-In Wafer/Panel-Level Chip-Scale Packages,First of all, as the name “fan-in wafer/panel-level chip-scale packages” indicates that packages are fabricated on a wafer or panel.
切割
发表于 2025-3-29 10:08:35
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单调性
发表于 2025-3-29 11:32:33
2D, 2.1D, and 2.3D IC Integration,In this chapter, 2D, 2.1D, and 2.3D IC integrations will be discussed. In 2D IC integration, wire bonding, flip chip, a mix of wire bonding and flip chip, fan-out with chip-first, fan-out with chip-last, and fan-out with chip-last on hybrid RDLs will be presented.
松软
发表于 2025-3-29 16:18:22
2.5D IC Integration,The 2.5D IC integration defined by the electronic semiconductor industry as chips are supported by a passive TSV (through-silicon via) interposer.