小缺点
发表于 2025-3-21 19:38:53
书目名称Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnec影响因子(影响力)<br> http://impactfactor.cn/if/?ISSN=BK0828022<br><br> <br><br>书目名称Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnec影响因子(影响力)学科排名<br> http://impactfactor.cn/ifr/?ISSN=BK0828022<br><br> <br><br>书目名称Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnec网络公开度<br> http://impactfactor.cn/at/?ISSN=BK0828022<br><br> <br><br>书目名称Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnec网络公开度学科排名<br> http://impactfactor.cn/atr/?ISSN=BK0828022<br><br> <br><br>书目名称Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnec被引频次<br> http://impactfactor.cn/tc/?ISSN=BK0828022<br><br> <br><br>书目名称Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnec被引频次学科排名<br> http://impactfactor.cn/tcr/?ISSN=BK0828022<br><br> <br><br>书目名称Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnec年度引用<br> http://impactfactor.cn/ii/?ISSN=BK0828022<br><br> <br><br>书目名称Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnec年度引用学科排名<br> http://impactfactor.cn/iir/?ISSN=BK0828022<br><br> <br><br>书目名称Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnec读者反馈<br> http://impactfactor.cn/5y/?ISSN=BK0828022<br><br> <br><br>书目名称Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnec读者反馈学科排名<br> http://impactfactor.cn/5yr/?ISSN=BK0828022<br><br> <br><br>
consolidate
发表于 2025-3-21 22:27:21
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promote
发表于 2025-3-22 04:10:19
Conclusions and Recommendations,The thesis presents a systematic research work of the chemical mechanical polishing (CMP) of Ru as a novel diffusion barrier layer for sub-14 nm technology node of the integrated circuit.
Alopecia-Areata
发表于 2025-3-22 05:53:57
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预感
发表于 2025-3-22 12:32:29
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infinite
发表于 2025-3-22 16:42:52
Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnec978-981-10-6165-3Series ISSN 2190-5053 Series E-ISSN 2190-5061
paradigm
发表于 2025-3-22 18:52:07
Introduction,Cu interconnects. It introduces the current situation of sub-14 nm technology node, the CMP technology, and the polishing of Ru as barrier layer material. The difficulties and challenges of Ru CMP are proposed based on the aforementioned discussion. The main research methods and experimental results of the thesis are shown in the last part.
Glycogen
发表于 2025-3-22 23:25:12
Synergetic Effect of Potassium Molybdate and Benzotriazole on the CMP of Ru and Cu in KIO4-Based Slof the material removal rate of Cu to Ru can be evidently improved in the presence of BTA and K.MoO.. The increase of oxidizer content and the reduction of polishing down force could help to further decrease the material removal rate selectivity between Cu and Ru.
hereditary
发表于 2025-3-23 02:41:42
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RUPT
发表于 2025-3-23 08:39:38
2190-5053 corrosion using different slurry additives. The findings presented here constitute a significant advance in fundamental and technical investigations into the CMP, while also laying the groundwork for future research..978-981-13-5585-1978-981-10-6165-3Series ISSN 2190-5053 Series E-ISSN 2190-5061