CODE 发表于 2025-3-23 10:29:00

ed with positivism, of modern technology as a mere application of science. I examine how and to what extent three French philosophers pursued non-Comtean insights into the relations between science and technology: some decades before the emerging STS wave that swept in as the 1970s wound down, they

贪婪的人 发表于 2025-3-23 14:10:34

g.Provides comprehensive presentation with applications and This book explains reliability techniques with examples from electronics design for the benefit of engineers. It presents the application of de-rating, FMEA, overstress analyses and reliability improvement tests for designing reliable elect

果仁 发表于 2025-3-23 21:57:20

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ingestion 发表于 2025-3-23 22:17:24

Generic Stress Factors and De-rating,ress factors of electronic components. The generic stress factors, ambient temperature, surface temperature, and junction temperature that are common to most components are explained with examples. The basics of de-rating, applying de-rating for stress factors, and thermal resistance are also explai

钝剑 发表于 2025-3-24 03:08:13

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indifferent 发表于 2025-3-24 09:56:14

Failure Mode and Effects Analysis,heir consequences for achieving total reliability. All engineers without exception do apply FMEA in the design of electronic equipment to prevent obvious design errors, and examples are provided for the application. However, the detection of latent design errors requires applying FMEA systematically

大暴雨 发表于 2025-3-24 13:30:17

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令人苦恼 发表于 2025-3-24 17:20:26

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讨好美人 发表于 2025-3-24 22:09:23

Failure Data Management,onic equipment. The failures are categorized as electrical performance, component and mechanical failures. Organizing a failure data management system (FDMS) to handle the failure data is presented. Practical considerations for the root cause analysis of component failures and classifying the origin

喃喃而言 发表于 2025-3-25 01:09:01

Reliability Database System for Design,evelopment activities of electronic equipment. Designing the database system to provide support for the application of components, overstress analyses, FMEA, internal verification testing, qualification testing, and failure analysis reports is explained.
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查看完整版本: Titlebook: Reliable Design of Electronic Equipment; An Engineering Guide Dhanasekharan Natarajan Book 2015 Springer International Publishing Switzerla