aggression 发表于 2025-3-21 17:59:36

书目名称Reliability of Electronic Components影响因子(影响力)<br>        http://impactfactor.cn/if/?ISSN=BK0826407<br><br>        <br><br>书目名称Reliability of Electronic Components影响因子(影响力)学科排名<br>        http://impactfactor.cn/ifr/?ISSN=BK0826407<br><br>        <br><br>书目名称Reliability of Electronic Components网络公开度<br>        http://impactfactor.cn/at/?ISSN=BK0826407<br><br>        <br><br>书目名称Reliability of Electronic Components网络公开度学科排名<br>        http://impactfactor.cn/atr/?ISSN=BK0826407<br><br>        <br><br>书目名称Reliability of Electronic Components被引频次<br>        http://impactfactor.cn/tc/?ISSN=BK0826407<br><br>        <br><br>书目名称Reliability of Electronic Components被引频次学科排名<br>        http://impactfactor.cn/tcr/?ISSN=BK0826407<br><br>        <br><br>书目名称Reliability of Electronic Components年度引用<br>        http://impactfactor.cn/ii/?ISSN=BK0826407<br><br>        <br><br>书目名称Reliability of Electronic Components年度引用学科排名<br>        http://impactfactor.cn/iir/?ISSN=BK0826407<br><br>        <br><br>书目名称Reliability of Electronic Components读者反馈<br>        http://impactfactor.cn/5y/?ISSN=BK0826407<br><br>        <br><br>书目名称Reliability of Electronic Components读者反馈学科排名<br>        http://impactfactor.cn/5yr/?ISSN=BK0826407<br><br>        <br><br>

intuition 发表于 2025-3-21 23:25:54

Reliability of diodes, diodes. Among the important characteristics that can’t be exceeded, the reverse voltage, the forward current and the maximum junction temperature (including data concerning the thermal resistance at high temperature) may be mentioned.

grandiose 发表于 2025-3-22 03:16:21

Reliability of optoelectronic components,ed; however the main emphasis of this chapter will be the understanding of degradation processes in LEDs and optocouplers. In Fig.10.1 a classification of optoelectronic semiconductor components is given.

Dorsal-Kyphosis 发表于 2025-3-22 08:06:15

http://reply.papertrans.cn/83/8265/826407/826407_4.png

Crayon 发表于 2025-3-22 12:30:27

http://reply.papertrans.cn/83/8265/826407/826407_5.png

Hyperplasia 发表于 2025-3-22 14:53:21

http://reply.papertrans.cn/83/8265/826407/826407_6.png

incarcerate 发表于 2025-3-22 19:13:27

http://reply.papertrans.cn/83/8265/826407/826407_7.png

Engaging 发表于 2025-3-23 01:08:02

http://reply.papertrans.cn/83/8265/826407/826407_8.png

Intersect 发表于 2025-3-23 05:05:55

Reliability of passive electronic parts,are used. Such failure analyses help in identifying device failure modes, mechanisms, and stress factors that influence degradation . The . (infant mortality, or failure during the burn-in or debugging period) occur at high initial failure rate λ- which is the number of failures of a part per u

顽固 发表于 2025-3-23 07:52:35

Reliability of diodes,applied voltage …. The silicon is used almost exclusively as semiconductor material. The main constructive forms are planar diodes and MESA diodes. Among the important characteristics that can’t be exceeded, the reverse voltage, the forward current and the maximum junction temperature (in
页: [1] 2 3 4 5 6
查看完整版本: Titlebook: Reliability of Electronic Components; A Practical Guide to Titu I. Băjenescu,Marius I. Bâzu Book 1999 Springer-Verlag Berlin Heidelberg 199