informed
发表于 2025-3-21 18:49:22
书目名称Recent Progress in Lead-Free Solder Technology影响因子(影响力)<br> http://impactfactor.cn/if/?ISSN=BK0823310<br><br> <br><br>书目名称Recent Progress in Lead-Free Solder Technology影响因子(影响力)学科排名<br> http://impactfactor.cn/ifr/?ISSN=BK0823310<br><br> <br><br>书目名称Recent Progress in Lead-Free Solder Technology网络公开度<br> http://impactfactor.cn/at/?ISSN=BK0823310<br><br> <br><br>书目名称Recent Progress in Lead-Free Solder Technology网络公开度学科排名<br> http://impactfactor.cn/atr/?ISSN=BK0823310<br><br> <br><br>书目名称Recent Progress in Lead-Free Solder Technology被引频次<br> http://impactfactor.cn/tc/?ISSN=BK0823310<br><br> <br><br>书目名称Recent Progress in Lead-Free Solder Technology被引频次学科排名<br> http://impactfactor.cn/tcr/?ISSN=BK0823310<br><br> <br><br>书目名称Recent Progress in Lead-Free Solder Technology年度引用<br> http://impactfactor.cn/ii/?ISSN=BK0823310<br><br> <br><br>书目名称Recent Progress in Lead-Free Solder Technology年度引用学科排名<br> http://impactfactor.cn/iir/?ISSN=BK0823310<br><br> <br><br>书目名称Recent Progress in Lead-Free Solder Technology读者反馈<br> http://impactfactor.cn/5y/?ISSN=BK0823310<br><br> <br><br>书目名称Recent Progress in Lead-Free Solder Technology读者反馈学科排名<br> http://impactfactor.cn/5yr/?ISSN=BK0823310<br><br> <br><br>
易弯曲
发表于 2025-3-21 21:42:13
Tin Whiskers Growth in Electronic Assemblieswth is induced by the relaxation of the compressive stress in the tin layer. Besides, the driving force for whisker growth increases with the temperature (<150 °C). Yet, annealing at 150 °C could reduce the whisker growth because grain coarsening reduces the inner compressive stress.
整洁漂亮
发表于 2025-3-22 02:54:49
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表状态
发表于 2025-3-22 07:41:19
Surface Modifications on Ceramic Reinforcement for Tin-Based Composite Soldersain parameters and setup, and latest developments on the surface-modified ceramic-reinforced composite lead-free solders. Finally, the chapter also summarised and discussed the advantages, current trends, and significant findings in this field.
开花期女
发表于 2025-3-22 12:41:53
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过分
发表于 2025-3-22 14:31:22
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社团
发表于 2025-3-22 18:13:02
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Generalize
发表于 2025-3-22 21:39:41
Recent Studies in the Development of Ceramic-Reinforced Lead-Free Composite Solder current electronics packaging desired performances. One of the leading choices in upgrading the existing lead-free alloys is by ceramic composite technology approach. The addition of ceramic particles into lead-free solder has altered and subsequently improved monolithic solder’s microstructural, p
额外的事
发表于 2025-3-23 04:57:37
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Aviary
发表于 2025-3-23 06:58:44
Surface Modifications on Ceramic Reinforcement for Tin-Based Composite Solders solders. It is commonly known that composite solders experienced significant aggregation and non-wetting issues between the ceramic reinforcements and solder matrix, which makes the addition of the reinforcement phase inefficient in improving the properties of lead-free solders. Surface modificatio