调戏
发表于 2025-3-21 18:24:45
书目名称Oncoplastic and Reconstructive Breast Surgery影响因子(影响力)<br> http://figure.impactfactor.cn/if/?ISSN=BK0701400<br><br> <br><br>书目名称Oncoplastic and Reconstructive Breast Surgery影响因子(影响力)学科排名<br> http://figure.impactfactor.cn/ifr/?ISSN=BK0701400<br><br> <br><br>书目名称Oncoplastic and Reconstructive Breast Surgery网络公开度<br> http://figure.impactfactor.cn/at/?ISSN=BK0701400<br><br> <br><br>书目名称Oncoplastic and Reconstructive Breast Surgery网络公开度学科排名<br> http://figure.impactfactor.cn/atr/?ISSN=BK0701400<br><br> <br><br>书目名称Oncoplastic and Reconstructive Breast Surgery被引频次<br> http://figure.impactfactor.cn/tc/?ISSN=BK0701400<br><br> <br><br>书目名称Oncoplastic and Reconstructive Breast Surgery被引频次学科排名<br> http://figure.impactfactor.cn/tcr/?ISSN=BK0701400<br><br> <br><br>书目名称Oncoplastic and Reconstructive Breast Surgery年度引用<br> http://figure.impactfactor.cn/ii/?ISSN=BK0701400<br><br> <br><br>书目名称Oncoplastic and Reconstructive Breast Surgery年度引用学科排名<br> http://figure.impactfactor.cn/iir/?ISSN=BK0701400<br><br> <br><br>书目名称Oncoplastic and Reconstructive Breast Surgery读者反馈<br> http://figure.impactfactor.cn/5y/?ISSN=BK0701400<br><br> <br><br>书目名称Oncoplastic and Reconstructive Breast Surgery读者反馈学科排名<br> http://figure.impactfactor.cn/5yr/?ISSN=BK0701400<br><br> <br><br>
方舟
发表于 2025-3-22 00:00:57
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温室
发表于 2025-3-22 04:03:47
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Lipohypertrophy
发表于 2025-3-22 06:15:42
https://doi.org/10.1007/978-88-470-2652-0breast cancer; image guided biopsy; lipofilling; reconstructive surgery; surgical oncology
incarcerate
发表于 2025-3-22 08:59:41
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COLON
发表于 2025-3-22 13:52:53
el 3-D ICs.Includes chapters contributed by various experts Three-dimensional (3D) integration is clearly the simplest answer to most of the semiconductor industry’s vexing problems: heterogeneous integration and red- tions of power, form factor, delay, and even cost. Conceptually the power, latency
柏树
发表于 2025-3-22 19:50:23
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拥护者
发表于 2025-3-23 00:04:47
Gail S. Lebovicel 3-D ICs.Includes chapters contributed by various experts Three-dimensional (3D) integration is clearly the simplest answer to most of the semiconductor industry’s vexing problems: heterogeneous integration and red- tions of power, form factor, delay, and even cost. Conceptually the power, latency
驾驶
发表于 2025-3-23 01:56:17
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膝盖
发表于 2025-3-23 09:04:58
Linei Urban,Cicero Urbannd red- tions of power, form factor, delay, and even cost. Conceptually the power, latency, and form factor of a system with a ?xed number of transistors all scale roughly linearly with the diameter of the smallest sphere enclosing frequently interacting devices. This clearly provides the fundamenta