Arresting
发表于 2025-3-26 22:30:31
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对手
发表于 2025-3-27 04:44:08
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Ventilator
发表于 2025-3-27 07:15:00
P. I. M. Johannesmatechnology as a replacement for through-hole tech nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher
Priapism
发表于 2025-3-27 12:10:28
J.-Cl. Levy as a replacement for through-hole tech nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher lead count
obscurity
发表于 2025-3-27 17:08:35
S. Noguchi,K. Nagasawa,J. Oizumi as a replacement for through-hole tech nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher lead count
CLOT
发表于 2025-3-27 18:37:44
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滔滔不绝地讲
发表于 2025-3-27 23:04:20
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抚育
发表于 2025-3-28 03:50:14
B. Touschektechnology as a replacement for through-hole tech nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher
ventilate
发表于 2025-3-28 09:45:03
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Deceit
发表于 2025-3-28 13:14:09
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