incompatible
发表于 2025-3-21 19:15:48
书目名称Nanoelectronic Coupled Problems Solutions影响因子(影响力)<br> http://figure.impactfactor.cn/if/?ISSN=BK0660720<br><br> <br><br>书目名称Nanoelectronic Coupled Problems Solutions影响因子(影响力)学科排名<br> http://figure.impactfactor.cn/ifr/?ISSN=BK0660720<br><br> <br><br>书目名称Nanoelectronic Coupled Problems Solutions网络公开度<br> http://figure.impactfactor.cn/at/?ISSN=BK0660720<br><br> <br><br>书目名称Nanoelectronic Coupled Problems Solutions网络公开度学科排名<br> http://figure.impactfactor.cn/atr/?ISSN=BK0660720<br><br> <br><br>书目名称Nanoelectronic Coupled Problems Solutions被引频次<br> http://figure.impactfactor.cn/tc/?ISSN=BK0660720<br><br> <br><br>书目名称Nanoelectronic Coupled Problems Solutions被引频次学科排名<br> http://figure.impactfactor.cn/tcr/?ISSN=BK0660720<br><br> <br><br>书目名称Nanoelectronic Coupled Problems Solutions年度引用<br> http://figure.impactfactor.cn/ii/?ISSN=BK0660720<br><br> <br><br>书目名称Nanoelectronic Coupled Problems Solutions年度引用学科排名<br> http://figure.impactfactor.cn/iir/?ISSN=BK0660720<br><br> <br><br>书目名称Nanoelectronic Coupled Problems Solutions读者反馈<br> http://figure.impactfactor.cn/5y/?ISSN=BK0660720<br><br> <br><br>书目名称Nanoelectronic Coupled Problems Solutions读者反馈学科排名<br> http://figure.impactfactor.cn/5yr/?ISSN=BK0660720<br><br> <br><br>
希望
发表于 2025-3-21 22:38:09
Nanoelectronic Coupled Problems Solutions978-3-030-30726-4Series ISSN 1612-3956 Series E-ISSN 2198-3283
Deadpan
发表于 2025-3-22 03:16:40
E. Jan W. ter Maten,Hans-Georg Brachtendorf,HerberCombines advanced methods for solving strongly coupled problems involving multirate dynamics in time and frequency domain with applications to Uncertainty Quantification and Fast Fault Simulation.Uniq
不确定
发表于 2025-3-22 08:05:19
EM-Equations, Coupling to Heat and to Circuitse considered, in particular: (1) the coupling of electromagnetic fields with circuits and (2) the electro-thermal coupling in power transistors. These cases are not exhaustive but are used as typical for identifying generic guidelines for addressing coupled problems.
行业
发表于 2025-3-22 10:23:41
Bond Wire Modelse bond wire properties, e.g., its time to failure. Secondly, a more accurate model using the finite integration technique for spatial discretisation is constructed. This model is also used to study the impact of manufacturing uncertainties, e.g., variable bond wire lengths, on the performance of bond wires.
民间传说
发表于 2025-3-22 16:46:46
Discretizationspproach. Furthermore the set up of coupled problems is addressed. Finally, it is shown that discretization requires a careful handling of the various terms in the discretization procedure, otherwise numerical unstable equations will appear.
Enthralling
发表于 2025-3-22 19:59:56
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Grandstand
发表于 2025-3-22 23:13:47
https://doi.org/10.1007/978-3-030-30726-4multirate; model order reduction; co-simulation; uncertainty quantification; power-MOS devices; RF-circui
FACT
发表于 2025-3-23 02:46:01
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scoliosis
发表于 2025-3-23 05:50:28
Book 2019bility in order to guarantee quality and yield. It also requires the incorporation of higher abstraction levels to allow for system simulation in order to shorten the design cycles, while at the same time preserving accuracy. The methods developed here promote a methodology for circuit-and-system-le