N斯巴达人 发表于 2025-3-23 10:12:11

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VERT 发表于 2025-3-23 13:54:33

Physical Vapor Deposition, to transistors. With the ever-increasing complexity of silicon integrated circuits and the development of GaAs circuits, a much wider range of materials must be deposited to fulfill special needs for patterning, electromigration, diffusion barriers, Schottky contacts, air bridges, etc. (Table 1); a

LUT 发表于 2025-3-23 18:22:12

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Negligible 发表于 2025-3-24 00:40:14

Dielectric Materials,e years. Their major functions have been for isolating circuit elements, serving as material for storage capacitors, masking against or gettering of trace impurities, masking against oxygen and dopant diffusion, passivating and protecting device surfaces, insulating double-level conductor lines, and

Anguish 发表于 2025-3-24 04:59:26

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羊齿 发表于 2025-3-24 10:29:50

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补助 发表于 2025-3-24 14:37:51

Fine-Line Lithography, but there are many others of significance including opto-electronic components, thin film magnetic recording heads, surface wave devices and structures so small that they can be used by physicists to probe quantum effects in electronic conduction. The range of sizes encompassed by these devices and

远足 发表于 2025-3-24 17:39:21

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马具 发表于 2025-3-24 21:53:49

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Genteel 发表于 2025-3-25 00:15:43

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查看完整版本: Titlebook: Microelectronic Materials and Processes; R. A. Levy Book 1989 Kluwer Academic Publishers 1989 Metall.X-Ray.alloy.crystal.semiconductors