法庭
发表于 2025-3-21 17:35:00
书目名称Metal-Dielectric Interfaces in Gigascale Electronics影响因子(影响力)<br> http://figure.impactfactor.cn/if/?ISSN=BK0631480<br><br> <br><br>书目名称Metal-Dielectric Interfaces in Gigascale Electronics影响因子(影响力)学科排名<br> http://figure.impactfactor.cn/ifr/?ISSN=BK0631480<br><br> <br><br>书目名称Metal-Dielectric Interfaces in Gigascale Electronics网络公开度<br> http://figure.impactfactor.cn/at/?ISSN=BK0631480<br><br> <br><br>书目名称Metal-Dielectric Interfaces in Gigascale Electronics网络公开度学科排名<br> http://figure.impactfactor.cn/atr/?ISSN=BK0631480<br><br> <br><br>书目名称Metal-Dielectric Interfaces in Gigascale Electronics被引频次<br> http://figure.impactfactor.cn/tc/?ISSN=BK0631480<br><br> <br><br>书目名称Metal-Dielectric Interfaces in Gigascale Electronics被引频次学科排名<br> http://figure.impactfactor.cn/tcr/?ISSN=BK0631480<br><br> <br><br>书目名称Metal-Dielectric Interfaces in Gigascale Electronics年度引用<br> http://figure.impactfactor.cn/ii/?ISSN=BK0631480<br><br> <br><br>书目名称Metal-Dielectric Interfaces in Gigascale Electronics年度引用学科排名<br> http://figure.impactfactor.cn/iir/?ISSN=BK0631480<br><br> <br><br>书目名称Metal-Dielectric Interfaces in Gigascale Electronics读者反馈<br> http://figure.impactfactor.cn/5y/?ISSN=BK0631480<br><br> <br><br>书目名称Metal-Dielectric Interfaces in Gigascale Electronics读者反馈学科排名<br> http://figure.impactfactor.cn/5yr/?ISSN=BK0631480<br><br> <br><br>
MAPLE
发表于 2025-3-21 20:58:15
http://reply.papertrans.cn/64/6315/631480/631480_2.png
性冷淡
发表于 2025-3-22 04:06:48
http://reply.papertrans.cn/64/6315/631480/631480_3.png
Emg827
发表于 2025-3-22 06:12:51
http://reply.papertrans.cn/64/6315/631480/631480_4.png
引水渠
发表于 2025-3-22 10:28:03
Cu-Dielectric Interfaces, In the dual damascene interconnect structure, Cu interconnects are surrounded by various barriers. The Cu lines are capped with a dielectric layer of materials, which is used as a diffusion barrier and an etch-stop layer. Cu migration through the capping layer is an increasingly serious concern bec
遍及
发表于 2025-3-22 16:19:16
,Barrier Metal–Dielectric Interfaces,nd drift into interlayer dielectrics. These barriers can also block oxygen/moisture penetration from the dielectrics into the Cu lines, preventing the oxidation of Cu, which can be the source of Cu ions.
躲债
发表于 2025-3-22 19:48:35
http://reply.papertrans.cn/64/6315/631480/631480_7.png
Strength
发表于 2025-3-22 23:01:09
http://reply.papertrans.cn/64/6315/631480/631480_8.png
Free-Radical
发表于 2025-3-23 01:59:10
ns, especially but not only in developing countries, intensify. Therefore, there is an increasing need to search for integrated solutions to make development more sustainable. The United Nations has acknowledged the problem and approved the “2030 Agenda for Sustainable Development”. On 1st January 2
harangue
发表于 2025-3-23 09:13:04
Ming He,Toh-Ming Luns, especially but not only in developing countries, intensify. Therefore, there is an increasing need to search for integrated solutions to make development more sustainable. The United Nations has acknowledged the problem and approved the “2030 Agenda for Sustainable Development”. On 1st January 2