JAR 发表于 2025-3-21 17:26:03
书目名称Measure of the Moon影响因子(影响力)<br> http://figure.impactfactor.cn/if/?ISSN=BK0628063<br><br> <br><br>书目名称Measure of the Moon影响因子(影响力)学科排名<br> http://figure.impactfactor.cn/ifr/?ISSN=BK0628063<br><br> <br><br>书目名称Measure of the Moon网络公开度<br> http://figure.impactfactor.cn/at/?ISSN=BK0628063<br><br> <br><br>书目名称Measure of the Moon网络公开度学科排名<br> http://figure.impactfactor.cn/atr/?ISSN=BK0628063<br><br> <br><br>书目名称Measure of the Moon被引频次<br> http://figure.impactfactor.cn/tc/?ISSN=BK0628063<br><br> <br><br>书目名称Measure of the Moon被引频次学科排名<br> http://figure.impactfactor.cn/tcr/?ISSN=BK0628063<br><br> <br><br>书目名称Measure of the Moon年度引用<br> http://figure.impactfactor.cn/ii/?ISSN=BK0628063<br><br> <br><br>书目名称Measure of the Moon年度引用学科排名<br> http://figure.impactfactor.cn/iir/?ISSN=BK0628063<br><br> <br><br>书目名称Measure of the Moon读者反馈<br> http://figure.impactfactor.cn/5y/?ISSN=BK0628063<br><br> <br><br>书目名称Measure of the Moon读者反馈学科排名<br> http://figure.impactfactor.cn/5yr/?ISSN=BK0628063<br><br> <br><br>conception 发表于 2025-3-21 21:40:26
http://reply.papertrans.cn/63/6281/628063/628063_2.pnganthropologist 发表于 2025-3-22 01:35:22
http://reply.papertrans.cn/63/6281/628063/628063_3.png先行 发表于 2025-3-22 05:00:54
d electronics progresses (along with the optical tech nology), the boundary where OTDM becomes more convenient than ETDM is still blurred and is a time-dependent variable. While the main design guidelines for 978-1-85233-641-7978-1-4471-0525-1EWE 发表于 2025-3-22 10:27:02
d electronics progresses (along with the optical tech nology), the boundary where OTDM becomes more convenient than ETDM is still blurred and is a time-dependent variable. While the main design guidelines for 978-1-85233-641-7978-1-4471-0525-1按等级 发表于 2025-3-22 16:16:40
http://reply.papertrans.cn/63/6281/628063/628063_6.pngObstacle 发表于 2025-3-22 20:14:12
http://reply.papertrans.cn/63/6281/628063/628063_7.png红润 发表于 2025-3-22 23:23:49
G. Colombois however still in competition with Electronic TDM (ETDM), and as technology in integrated electronics progresses (along with the optical tech nology), the boundary where OTDM becomes more convenient than ETDM is still blurred and is a time-dependent variable. While the main design guidelines forlegacy 发表于 2025-3-23 04:33:52
http://reply.papertrans.cn/63/6281/628063/628063_9.png恃强凌弱的人 发表于 2025-3-23 09:25:49
J. Mietelski between the computational mechanics code — ., and the design optimisation tool — .. Simulations will predict the thermal mismatch between the different materials in the assembly (i.e. silicon chip and printed circuit board) — resulting in high shear strains across the solder interconnects, and used