字里行间 发表于 2025-3-21 18:37:12
书目名称Materials & Process Integration for MEMS影响因子(影响力)<br> http://figure.impactfactor.cn/if/?ISSN=BK0625752<br><br> <br><br>书目名称Materials & Process Integration for MEMS影响因子(影响力)学科排名<br> http://figure.impactfactor.cn/ifr/?ISSN=BK0625752<br><br> <br><br>书目名称Materials & Process Integration for MEMS网络公开度<br> http://figure.impactfactor.cn/at/?ISSN=BK0625752<br><br> <br><br>书目名称Materials & Process Integration for MEMS网络公开度学科排名<br> http://figure.impactfactor.cn/atr/?ISSN=BK0625752<br><br> <br><br>书目名称Materials & Process Integration for MEMS被引频次<br> http://figure.impactfactor.cn/tc/?ISSN=BK0625752<br><br> <br><br>书目名称Materials & Process Integration for MEMS被引频次学科排名<br> http://figure.impactfactor.cn/tcr/?ISSN=BK0625752<br><br> <br><br>书目名称Materials & Process Integration for MEMS年度引用<br> http://figure.impactfactor.cn/ii/?ISSN=BK0625752<br><br> <br><br>书目名称Materials & Process Integration for MEMS年度引用学科排名<br> http://figure.impactfactor.cn/iir/?ISSN=BK0625752<br><br> <br><br>书目名称Materials & Process Integration for MEMS读者反馈<br> http://figure.impactfactor.cn/5y/?ISSN=BK0625752<br><br> <br><br>书目名称Materials & Process Integration for MEMS读者反馈学科排名<br> http://figure.impactfactor.cn/5yr/?ISSN=BK0625752<br><br> <br><br>Mitigate 发表于 2025-3-21 21:13:34
Integration of Piezoelectric Pb(ZrxTi1-x)O3 (PZT) Thin Films into Micromachined Sensors and Actuatoon to control the bending of cantilevers as well as the stretching forces at membranes. Advanced dry etching techniques are needed for patterning the electrode films without damage to PZT, and without leaving residues. Some recent results on cantilever-microphone and piezoelectric micromachined ultrasonic transducer (pMUT) are presented.Wordlist 发表于 2025-3-22 03:58:29
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Tactical Grade MEMS Gyroscopes Fabricated by the SBM Process,rsion, the measured values are 0.024./sec, ±50°/sec, and 33 Hz, respectively. The angle random walk for versions one and two are 0.0025°/ sec/√Hz and 0.0042°/sec/√Hz, respectively. These performance specifications put the SBM fabricated MEMS gyroscopes in the “tactical grade”.Dignant 发表于 2025-3-22 10:17:39
1389-2134 academicians and engineers from around the world are increasingly devoting their efforts on the materials and process integration issues and opportunities in MEMS devices. These efforts are crucial to sustain the long-term growth of the MEMS field. The commercial MEMS community is heavily driven bybypass 发表于 2025-3-22 14:52:27
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