GURU 发表于 2025-3-21 16:08:01

书目名称Manufacturing Challenges in Electronic Packaging影响因子(影响力)<br>        http://impactfactor.cn/if/?ISSN=BK0623620<br><br>        <br><br>书目名称Manufacturing Challenges in Electronic Packaging影响因子(影响力)学科排名<br>        http://impactfactor.cn/ifr/?ISSN=BK0623620<br><br>        <br><br>书目名称Manufacturing Challenges in Electronic Packaging网络公开度<br>        http://impactfactor.cn/at/?ISSN=BK0623620<br><br>        <br><br>书目名称Manufacturing Challenges in Electronic Packaging网络公开度学科排名<br>        http://impactfactor.cn/atr/?ISSN=BK0623620<br><br>        <br><br>书目名称Manufacturing Challenges in Electronic Packaging被引频次<br>        http://impactfactor.cn/tc/?ISSN=BK0623620<br><br>        <br><br>书目名称Manufacturing Challenges in Electronic Packaging被引频次学科排名<br>        http://impactfactor.cn/tcr/?ISSN=BK0623620<br><br>        <br><br>书目名称Manufacturing Challenges in Electronic Packaging年度引用<br>        http://impactfactor.cn/ii/?ISSN=BK0623620<br><br>        <br><br>书目名称Manufacturing Challenges in Electronic Packaging年度引用学科排名<br>        http://impactfactor.cn/iir/?ISSN=BK0623620<br><br>        <br><br>书目名称Manufacturing Challenges in Electronic Packaging读者反馈<br>        http://impactfactor.cn/5y/?ISSN=BK0623620<br><br>        <br><br>书目名称Manufacturing Challenges in Electronic Packaging读者反馈学科排名<br>        http://impactfactor.cn/5yr/?ISSN=BK0623620<br><br>        <br><br>

歹徒 发表于 2025-3-21 22:23:35

http://reply.papertrans.cn/63/6237/623620/623620_2.png

类人猿 发表于 2025-3-22 02:09:17

Design for manufacture and assembly of electronic packages, different component technology such as chip-on-board (COB), very small peripheral arrays, chip scale packaging (CSP), μBGA’s and flip chip becoming mainstream (Tuck, 1995). Each advancement in technology brings new challenges to the manufacture and design of printed circuit boards. As a designer, o

Confess 发表于 2025-3-22 08:13:05

http://reply.papertrans.cn/63/6237/623620/623620_4.png

可憎 发表于 2025-3-22 09:08:31

; Chapter 3: Testing and characterization; Chapter 4: Design for manufacture and assembly of electronic packages; Chapter 5: Process modeling, optimization and control in electronics manufacturing; and Chapter 6: Integrated manufacturing system for printed circuit board assembly. The electronics-based product978-1-4613-7659-0978-1-4615-5803-3

指令 发表于 2025-3-22 13:13:52

W. T. Chen,A. K. Trivedi,J. A. Welshounds and on their modes of action and specificity of binding with the receptors based on experimental and theoretical studies. These studies constitute a valuable asset for all those involved in drug development. .978-3-0348-0764-7978-3-0348-0364-9Series ISSN 1664-431X Series E-ISSN 2504-3692

Collar 发表于 2025-3-22 18:46:33

P. Conway,D. J. Williamsounds and on their modes of action and specificity of binding with the receptors based on experimental and theoretical studies. These studies constitute a valuable asset for all those involved in drug development. .978-3-0348-0764-7978-3-0348-0364-9Series ISSN 1664-431X Series E-ISSN 2504-3692

生意行为 发表于 2025-3-23 00:28:56

http://reply.papertrans.cn/63/6237/623620/623620_8.png

Sciatica 发表于 2025-3-23 03:45:22

S. A. Leclerc,G. Subbarayanounds and on their modes of action and specificity of binding with the receptors based on experimental and theoretical studies. These studies constitute a valuable asset for all those involved in drug development. .978-3-0348-0764-7978-3-0348-0364-9Series ISSN 1664-431X Series E-ISSN 2504-3692

文艺 发表于 2025-3-23 07:28:45

http://reply.papertrans.cn/63/6237/623620/623620_10.png
页: [1] 2 3 4
查看完整版本: Titlebook: Manufacturing Challenges in Electronic Packaging; Y. C. Lee,W. T. Chen Book 1998 Springer Science+Business Media Dordrecht 1998 assembly.c