欺侮 发表于 2025-3-21 17:33:31
书目名称MEMS and Nanotechnology, Volume 8影响因子(影响力)<br> http://figure.impactfactor.cn/if/?ISSN=BK0620124<br><br> <br><br>书目名称MEMS and Nanotechnology, Volume 8影响因子(影响力)学科排名<br> http://figure.impactfactor.cn/ifr/?ISSN=BK0620124<br><br> <br><br>书目名称MEMS and Nanotechnology, Volume 8网络公开度<br> http://figure.impactfactor.cn/at/?ISSN=BK0620124<br><br> <br><br>书目名称MEMS and Nanotechnology, Volume 8网络公开度学科排名<br> http://figure.impactfactor.cn/atr/?ISSN=BK0620124<br><br> <br><br>书目名称MEMS and Nanotechnology, Volume 8被引频次<br> http://figure.impactfactor.cn/tc/?ISSN=BK0620124<br><br> <br><br>书目名称MEMS and Nanotechnology, Volume 8被引频次学科排名<br> http://figure.impactfactor.cn/tcr/?ISSN=BK0620124<br><br> <br><br>书目名称MEMS and Nanotechnology, Volume 8年度引用<br> http://figure.impactfactor.cn/ii/?ISSN=BK0620124<br><br> <br><br>书目名称MEMS and Nanotechnology, Volume 8年度引用学科排名<br> http://figure.impactfactor.cn/iir/?ISSN=BK0620124<br><br> <br><br>书目名称MEMS and Nanotechnology, Volume 8读者反馈<br> http://figure.impactfactor.cn/5y/?ISSN=BK0620124<br><br> <br><br>书目名称MEMS and Nanotechnology, Volume 8读者反馈学科排名<br> http://figure.impactfactor.cn/5yr/?ISSN=BK0620124<br><br> <br><br>阴险 发表于 2025-3-21 21:38:51
Barton C. Prorok,LaVern Starman,Gordon Shaw, IIIIncludes supplementary material:音乐戏剧 发表于 2025-3-22 04:27:11
Conference Proceedings of the Society for Experimental Mechanics Serieshttp://image.papertrans.cn/m/image/620124.jpg蜡烛 发表于 2025-3-22 05:02:41
978-3-319-36091-1The Society for Experimental Mechanics, Inc. 2015我正派 发表于 2025-3-22 11:26:22
MEMS and Nanotechnology, Volume 8978-3-319-07004-9Series ISSN 2191-5644 Series E-ISSN 2191-5652Epithelium 发表于 2025-3-22 14:30:14
Newly Discovered Pile Up Effects During Nanoindentation,tant to understand in order to prevent failure in nano- and microscale mechanical devices utilized in computers or cell phones. During nanoindentation tests, phenomena such as sink-in or pile-up can occur depending on the mismatch of elastic moduli and Poisson’s ratios. This, in turn, alters the pro–FER 发表于 2025-3-22 18:06:07
http://reply.papertrans.cn/63/6202/620124/620124_7.pngintention 发表于 2025-3-23 01:12:51
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Bonded Hemishell Approach to Encapsulate Microdevices in Spheroidal Packages,ropic etching methods were utilized to produce hemispherical cavities in silicon wafers. sulfur hexafluoride (SF.) based plasma was determined to be a preferable alternative to wet HNA etching when performing repeatable isotropic etches in silicon. Silicon crystal orientation’s effect on etch varianlanguid 发表于 2025-3-23 07:28:59
Development of an Infrared Direct Viewer Based on a MEMS Focal Plane Array,bi-material structures that deflect linearly as a function of temperature associated with infrared radiation from a scene. An optical readout system can be used to measure the deformation of the structures based on reflected light, and offers several advantages over the microbolometer sensors that a