Fibroid
发表于 2025-3-28 15:28:32
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debunk
发表于 2025-3-28 18:48:30
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Consensus
发表于 2025-3-28 23:16:07
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Pseudoephedrine
发表于 2025-3-29 05:29:34
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Texture
发表于 2025-3-29 08:27:54
High Performance Interconnect on Cofired Ceramic,s of high performance packaging. This paper illustrates one of the specific project tasks aimed at building a complex MCM-D (Polyimide-Copper on multilayer ceramic substrate) module populated with TAB bonded CMOS VLSI chips.
入伍仪式
发表于 2025-3-29 13:45:33
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SOBER
发表于 2025-3-29 19:17:22
Very Fine Line Photoimageable Thick Film Technology Developed at Hibridas, Lithuania,’ was set up during 1972 and specialized in the design and manufacture of microwave devices. Facilities included thick and thin film production equipment as well as metal packaging and hermetic sealing capability.
conformity
发表于 2025-3-29 20:44:56
Mass Memory Packaging for Space Applications,now generating high output data rates ten times higher than the maximum speed of the link between the spacecraft and the ground. The required capacity for year 1998 is around 100 Gbit, end of life, and the input data rate is 400 Mbit/s minimum.
过渡时期
发表于 2025-3-30 03:13:42
Design and Realization of a Multichip Module as a Motion Estimator for HDTV-Applications,f which have approximately 300 pins with a pitch of 120 μm. The chips are wire bonded on the module. The module will be mounted face down on the motherboard. The first prototypes proved to be functional.
破布
发表于 2025-3-30 04:17:04
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