geometrician
发表于 2025-3-27 00:58:57
High Performance Ceramic Modules and Packages,looking for lower cost alternatives than what has been available previously..With the advent of low temperature dielectric tape, finer grind thick film conductor inks and higher resolution emulsions a much higher density ceramic multichip module is now possible. This module is approaching what has b
eucalyptus
发表于 2025-3-27 02:27:24
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ABASH
发表于 2025-3-27 07:15:19
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使激动
发表于 2025-3-27 11:28:25
ALN Cofired MCM-C/D,ay with thin film processing, and the high speed (>2 GHz) electrical performance of deposited TiW-Au / polyimide interconnections and the cofired tungsten vias. The test cell supports a multilayer interconnect structure designed to allow for characterization of signal propagation properties (e.g. im
丰富
发表于 2025-3-27 15:32:59
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有其法作用
发表于 2025-3-27 18:03:19
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JOT
发表于 2025-3-28 01:13:32
Mass Memory Packaging for Space Applications, the satellite is not always in visibility of earth stations, and so cannot transmit its informations in real time. Optical and radar instruments are now generating high output data rates ten times higher than the maximum speed of the link between the spacecraft and the ground. The required capacity
远足
发表于 2025-3-28 04:56:33
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intelligible
发表于 2025-3-28 09:30:10
Multi-Chip Module Applications in Satellite Communications,s (MCMs) and low cost packaging technologies — whose properties offer significant advantages in space and locations involving exposure to radiation. Communication via satellites located in space require performance at high frequencies in the microwave range (delivered by silicon or GaAs MMICs- monol
Hemodialysis
发表于 2025-3-28 11:06:40
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