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发表于 2025-3-23 11:41:42
Shear Creep-Fatigue Behavior of Cu/Pb-Free Solder Joints,r joints usually consist of a strain hardening stage, a steady deformation stage, and an accelerating fracture stage. For the Sn–4Ag/Cu solder joints, the strain increases rapidly during the initial few cycles, until strain hardening reaches a saturated state. After that the strain increases linearl
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发表于 2025-3-23 17:27:10
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发表于 2025-3-23 20:06:22
Conclusions,ation, a series of experimental schemes were designed according to the structure of the Pb-free solder joints and the loadings applied on them; the damage behavior of the solder joints at different loadings were comprehensively revealed, in order to provide some useful suggestion for reliability eva
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发表于 2025-3-23 22:50:57
978-3-662-51725-3Springer-Verlag Berlin Heidelberg 2016
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发表于 2025-3-24 05:53:07
Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces978-3-662-48823-2Series ISSN 2190-5053 Series E-ISSN 2190-5061
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发表于 2025-3-24 07:04:02
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发表于 2025-3-24 11:36:16
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发表于 2025-3-24 18:33:37
Springer Theseshttp://image.papertrans.cn/i/image/474812.jpg
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发表于 2025-3-25 02:11:48
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