ATE
发表于 2025-3-21 19:56:09
书目名称Introduction to VLSI Process Engineering影响因子(影响力)<br> http://impactfactor.cn/if/?ISSN=BK0474308<br><br> <br><br>书目名称Introduction to VLSI Process Engineering影响因子(影响力)学科排名<br> http://impactfactor.cn/ifr/?ISSN=BK0474308<br><br> <br><br>书目名称Introduction to VLSI Process Engineering网络公开度<br> http://impactfactor.cn/at/?ISSN=BK0474308<br><br> <br><br>书目名称Introduction to VLSI Process Engineering网络公开度学科排名<br> http://impactfactor.cn/atr/?ISSN=BK0474308<br><br> <br><br>书目名称Introduction to VLSI Process Engineering被引频次<br> http://impactfactor.cn/tc/?ISSN=BK0474308<br><br> <br><br>书目名称Introduction to VLSI Process Engineering被引频次学科排名<br> http://impactfactor.cn/tcr/?ISSN=BK0474308<br><br> <br><br>书目名称Introduction to VLSI Process Engineering年度引用<br> http://impactfactor.cn/ii/?ISSN=BK0474308<br><br> <br><br>书目名称Introduction to VLSI Process Engineering年度引用学科排名<br> http://impactfactor.cn/iir/?ISSN=BK0474308<br><br> <br><br>书目名称Introduction to VLSI Process Engineering读者反馈<br> http://impactfactor.cn/5y/?ISSN=BK0474308<br><br> <br><br>书目名称Introduction to VLSI Process Engineering读者反馈学科排名<br> http://impactfactor.cn/5yr/?ISSN=BK0474308<br><br> <br><br>
紧张过度
发表于 2025-3-21 23:05:41
Packaging and process monitoring technology,ds of the chips and metal lead frames with fine wires. To prevent the chips from severe environments, they are covered with passivated materials. At this stage, it is possible to make the electrical connections to the printed circuit boards. The packaging technology necessary to seal Si devices is explained below.
啮齿动物
发表于 2025-3-22 00:48:33
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collagenase
发表于 2025-3-22 06:03:56
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交响乐
发表于 2025-3-22 10:51:55
Process engineering aspects of VLSI production,In the preceding chapters, the history, unit processes and scope of VLSI technology have been described. Chapter 5 was devoted to a case study in order to bring out the details of the process technology. This chapter will focus on how chemical engineering can be applied to VLSI technology.
恸哭
发表于 2025-3-22 14:44:56
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调味品
发表于 2025-3-22 18:49:27
https://doi.org/10.1007/978-94-011-1562-9manufacturing; process engineering; semiconductor; semiconductor technology; silicon
阐明
发表于 2025-3-22 22:53:44
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强壮
发表于 2025-3-23 04:03:57
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Hallmark
发表于 2025-3-23 08:29:18
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