思考才皱眉
发表于 2025-3-25 07:13:17
Book 2004in semiconductor manufacturing and in the production of other related products and devices, MEMS for example. Since its introduction some 15+ years ago CMP, as it is commonly called, has moved steadily into new and challenging areas of semiconductor fabrication. Demands on it for consistent, efficie
使害羞
发表于 2025-3-25 09:49:10
Wafer-Scale Modeling of CMP,egions where the material is removed faster. This causes a degradation of the circuit performance there. The WIWNU will also bring a systematic variation of the circuit performance across the wafer. A better understanding of the mechanisms driving the WIWNU will help to increase the yield and improve the circuit performance.
GILD
发表于 2025-3-25 13:18:43
Introduction,fer materials and planarize the wafer surface. A typical configuration of a rotational type CMP machine, where the relative movement is obtained from the rotations of the wafer carrier (polishing head) and polishing platen around their own centers, is shown schematically in Fig. 1.1 ..
delegate
发表于 2025-3-25 17:30:20
https://doi.org/10.1007/978-3-662-07928-7CMP; FEM; Fabrication; Mechanical Model; Production; REM; STEM; Semiconductor Technology; Wafer; integrated c
畏缩
发表于 2025-3-25 23:57:47
Jianfeng Luo,David A. DornfeldFirst book dedicated to the modeling of CMP for sub-micron integrated circuit (IC) fabrication.Modeling and simulation are critical to transfer CMP from an engineering ‘art’ to an engineering ‘science
genuine
发表于 2025-3-26 03:41:05
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宣传
发表于 2025-3-26 04:44:57
978-3-642-06115-8Springer-Verlag Berlin Heidelberg 2004
A简洁的
发表于 2025-3-26 11:55:01
Review of CMP Modeling,Although chemical mechanical planarization (CMP) is widely applied in integrated circuit fabrication, it is still a process of trial and error. Understanding the basic mechanism of this process has initiated research efforts from both industry and academia in the last decade. This chapter reviews previous CMP modeling efforts.
Nonporous
发表于 2025-3-26 13:00:17
Summary and Future Work,Chemical mechanical planarization models at three scales, namely, particle scale, feature and die scales and wafer scale, are presented in this work.
diathermy
发表于 2025-3-26 19:55:26
Book 2004ls which have not kept pace with the tremendous expansion of applications of CMP. Preston‘s equation is a valuable start but represents none of the subtleties of the process. Specifically, we refer to the development of models with sufficient detail to allow the evaluation and tradeoff of process in