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› Titlebook: Foldable Flex and Thinned Silicon Multichip Packaging Technology; John W. Balde (IMAPS Fellow, IEEE Fellow) Book 2003 Springer Science+Bus
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Titlebook: Foldable Flex and Thinned Silicon Multichip Packaging Technology; John W. Balde (IMAPS Fellow, IEEE Fellow) Book 2003 Springer Science+Bus