Colossal 发表于 2025-3-21 17:36:50

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engagement 发表于 2025-3-21 21:39:21

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查看完整版本: Titlebook: Foldable Flex and Thinned Silicon Multichip Packaging Technology; John W. Balde (IMAPS Fellow, IEEE Fellow) Book 2003 Springer Science+Bus