强所
发表于 2025-3-23 13:27:13
Thermal Effects on TSV Signal Integrity,e hundreds-of-MHz frequency range, increasing temperature decreases the S. of TSV channel, but over that frequency range, increasing temperature increases the S.. These phenomena are explained from the model which thermal dependence of the materials is applied.
小步舞
发表于 2025-3-23 17:23:25
Power Distribution Network Modeling and Analysis for TSV and Interposer-Based 3D ICs in the Frequen interposer-based 3D ICs in the frequency domain with respect to the variations in the main design issues for the PDNs such as the size of grid-type PDNs, the number of power/ground (P/G) TSVs, and the capacitance of the on-chip decoupling capacitors (on-chip decaps).
Hay-Fever
发表于 2025-3-23 18:15:48
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费解
发表于 2025-3-24 00:46:00
https://doi.org/10.1007/978-3-642-91504-8ng TSV, shielding bump. These methods are compared by showing shielding effectiveness, design restriction, consuming area, and manufacturing process compatibility and the several design guides are provided for choosing the adequate and best way among TSV noise coupling reduction methods considering real products.
Cpr951
发表于 2025-3-24 05:14:14
Noise Coupling and Shielding in 3D ICs,ng TSV, shielding bump. These methods are compared by showing shielding effectiveness, design restriction, consuming area, and manufacturing process compatibility and the several design guides are provided for choosing the adequate and best way among TSV noise coupling reduction methods considering real products.
Mere仅仅
发表于 2025-3-24 08:59:21
this book includes simulations, numerical modelings and measurements for verification. The author and co-authors in each chapter have studied deep into TSV for many years and the accumulated technical know-hows and tips for related subjects are comprehensively covered..978-94-017-7949-4978-94-017-9038-3
HPA533
发表于 2025-3-24 12:45:48
https://doi.org/10.1007/978-3-662-35217-5mented using TSV technologies. In this chapter, TSV decoupling schemes are introduced, showing that they have prominent advantages relative to reducing the inductive power distribution network (PDN) impedance and suppressing power noise such as the simultaneously switching noise (SSN) in the 3D ICs.
cultivated
发表于 2025-3-24 17:58:21
TSV Decoupling Schemes,mented using TSV technologies. In this chapter, TSV decoupling schemes are introduced, showing that they have prominent advantages relative to reducing the inductive power distribution network (PDN) impedance and suppressing power noise such as the simultaneously switching noise (SSN) in the 3D ICs.
Harness
发表于 2025-3-24 19:40:46
https://doi.org/10.1007/978-94-017-9038-33-Dimensional Integrated Circuit Design; Clock Distribution Networks; High Speed IC Design; Noise Coupl
尊严
发表于 2025-3-25 00:48:55
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